LEADER 05096nam 2200601 450 001 9910830298803321 005 20230721033247.0 010 $a1-281-94675-3 010 $a9786611946753 010 $a3-527-62218-7 010 $a3-527-62219-5 035 $a(CKB)1000000000553446 035 $a(EBL)481366 035 $a(SSID)ssj0000097807 035 $a(PQKBManifestationID)11120216 035 $a(PQKBTitleCode)TC0000097807 035 $a(PQKBWorkID)10132087 035 $a(PQKB)11638113 035 $a(MiAaPQ)EBC481366 035 $a(OCoLC)264615338 035 $a(EXLCZ)991000000000553446 100 $a20160818h20082008 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aAdvanced plasma technology /$fedited by Riccardo d'Agostino [and five others] 210 1$aWeinheim, Germany :$cWiley-VCH Verlag GmbH & Co. KGaA,$d2008. 210 4$dİ2008 215 $a1 online resource (481 p.) 300 $aDescription based upon print version of record. 311 $a3-527-40591-7 320 $aIncludes bibliographical references at the end of each chaptes and index. 327 $aAdvanced Plasma Technology; Contents; Preface; List of Contributors; 1 Basic Approaches to Plasma Production and Control; 1.1 Plasma Production; 1.1.1 Under Low Gas Pressure (10 torr); 1.2 Energy Control; 1.2.1 Electron-Temperature Control; 1.2.2 Ion-Energy Control; 1.3 Dust Collection and Removal; References; 2 Plasma Sources and Reactor Configurations; 2.1 Introduction; 2.2 Characteristics of ICP; 2.2.1 Principle; 2.2.2 Transformer Model; 2.2.3 Technological Aspects; 2.2.3.1 Matching 327 $a2.2.3.2 Capacitive Coupling2.2.3.3 Standing Wave Effects; 2.3 Sources and Reactor Configuration; 2.3.1 Substrate Shape; 2.3.1.1 Flat Substrates; 2.3.1.2 Complex Three-Dimensional Shapes; 2.3.1.3 Large Area Treatment; 2.4 Conclusions; References; 3 Advanced Simulations for Industrial Plasma Applications; 3.1 Introduction; 3.2 PIC Simulations; 3.2.1 Capacitively Coupled O(2)/Ar Plasmas; 3.2.1.1 Gas Composition; 3.2.1.2 Pressure Effect in Ar/O(2) Plasmas; 3.2.2 Three-Dimensional (3D) Charge-up Simulation; 3.2.2.1 Description of 3D Charge-up Simulations 327 $a3.2.2.2 Effects of Secondary Electron Emission3.2.2.3 Negative Ion Extraction; 3.3 Fluid Simulations; 3.3.1 Capacitively Coupled Discharges; 3.3.2 Large Area Plasma Source; 3.4 Summary; References; 4 Modeling and Diagnostics of He Discharges for Treatment of Polymers; 4.1 Introduction; 4.2 Experimental; 4.3 Model Description; 4.4 Results and Discussion; 4.4.1 Electrical Properties; 4.4.2 Gas-Phase Chemistry; 4.4.3 Plasma-Surface Interactions; 4.5 Conclusions; References; 5 Three-Dimensional Modeling of Thermal Plasmas (RF and Transferred Arc) for the Design of Sources and Industrial Processes 327 $a5.1 Introduction5.2 Inductively Coupled Plasma Torches; 5.2.1 Modeling Approach; 5.2.1.1 Modeling Assumptions; 5.2.1.2 Governing Equations of the Continuum Phase; 5.2.1.3 Governing Equations of the Discrete Phase; 5.2.1.4 Computational Domain and Boundary Conditions; 5.2.2 Selected Simulation Results; 5.2.2.1 High-Definition Numerical Simulation of Industrial ICPTs; 5.2.2.2 Numerical Simulation of the Trajectories and Thermal Histories of Powders Injected in Industrial ICPTs; 5.3 DC Transferred Arc Plasma Torches; 5.3.1 Modeling Approach; 5.3.1.1 Modeling Assumptions 327 $a5.3.1.2 Governing Equations5.3.1.3 Computational Domain and Boundary Conditions; 5.3.2 Selected Simulation Results; 5.3.2.1 Magnetically Deflected Transferred Arc; 5.3.2.2 The Twin Torch; 5.3.2.3 The Cutting Torch; References; 6 Radiofrequency Plasma Sources for Semiconductor Processing; 6.1 Introduction; 6.2 Capacitively Coupled Plasmas; 6.2.1 Dual-Frequency CCPs; 6.3 Inductively Coupled Plasmas; 6.3.1 General Description; 6.3.2 Anomalous Skin Depth; 6.3.3 Magnetized ICPs; 6.4 Helicon Wave Sources; 6.4.1 General Description; 6.4.2 Unusual Features; 6.4.3 Extended Helicon Sources; References 327 $a7 Advanced Plasma Diagnostics for Thin-Film Deposition 330 $aA panel of internationally renowned scientists discuss the latest results in plasma technology. This volume has been compiled with both a didactic approach and an overview of the newest achievements for industrial applications. It is divided into two main sections. One is focused on fundamental technology, including plasma production and control, high-pressure discharges, modeling and simulation, diagnostics, dust control, and etching. The section on application technology covers polymer treatments, silicon solar cell, coating and spray, biomaterials, sterilization and waste treatment, plasma 606 $aPlasma engineering 615 0$aPlasma engineering. 676 $a621.044 676 $a660.004 702 $aD'Agostino$b Riccardo 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910830298803321 996 $aAdvanced Plasma Technology$9804569 997 $aUNINA