LEADER 04400nam 2200661 450 001 9910830099503321 005 20240219142411.0 010 $a1-283-02524-8 010 $a9786613025241 010 $a1-118-10274-6 010 $a0-470-90119-5 010 $a0-470-90118-7 024 7 $a10.1002/9780470901199 035 $a(CKB)2560000000058659 035 $a(EBL)661562 035 $a(SSID)ssj0000477098 035 $a(PQKBManifestationID)11296721 035 $a(PQKBTitleCode)TC0000477098 035 $a(PQKBWorkID)10502263 035 $a(PQKB)10378048 035 $a(MiAaPQ)EBC661562 035 $a(CaBNVSL)mat05732782 035 $a(IDAMS)0b000064814ebff2 035 $a(IEEE)5732782 035 $a(OCoLC)705354458 035 $a(PPN)27320341X 035 $a(EXLCZ)992560000000058659 100 $a20151221d2011 uy 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aLead-free solder process development /$fJasbir Bath, Greg Henshall, Carol Handwerker 210 1$aHoboken, New Jersey :$cWiley,$dc2010. 210 2$a[Piscataqay, New Jersey] :$cIEEE Xplore,$d[2011] 215 $a1 online resource (286 p.) 300 $aDescription based upon print version of record. 311 $a0-470-41074-4 320 $aIncludes bibliographical references and index. 327 $aFront Matter -- Regulatory and Voluntary Drivers for Environmental Improvement: Hazardous Substances, Life-Cycle Design, and End of Life / John Hawley -- Lead-Free Surface Mount Technology / Jasbir Bath, Jennifer Nguyen, Sundar Sethuraman -- Lead-Free Wave Soldering / Denis Barbini, Jasbir Bath -- Lead-Free Rework / Alan Donaldson -- Lead-Free Alloys for BGA/CSP Components / Gregory Henshall -- Growth Mechanisms and Mitigation Strategies of Tin Whisker Growth / Peng Su -- Testability of Lead-Free Printed Circuit Assemblies / Rosa D Reinosa, Aileen M Allen -- Board-Level Solder Joint Reliability of High-Performance Computers Under Mechanical Loading / Keith Newman -- Lead-Free Reliability in Aerospace/Military Environments / Thomas A Woodrow, Jasbir Bath -- Lead-Free Reliability in Automotive Environments / Richard D Parker -- Index. 330 $aA fully up-to-date approach to implementing lead-free solderingEnvironmental and health concerns have led to a growing movement to eliminate lead from electronics, specifically from electronics soldering. Lead-based solder has been used for many years with a good history of use, so the change to lead-free solder alternatives requires companies to re-examine, develop, and re-test manufacturing processes as they make the transition.Lead-Free Solder Process Development covers general lead-free soldering topics written by those specializing in these areas. Timely and up to date, this reference covers key topics including legislation, SMT, wave, rework, alloys, test, and reliability. It provides updates in areas where research is ongoing and addresses various topics that are relevant to lead-free soldering, including:. Government and legislative activities. Lead-free SMT assembly. Lead-free wave soldering. Lead-free rework. Lead-free alloys for BGA/CSP components. Lead-free mechanical reliability. Tin whiskers. Lead-free reliability in aerospace and military environments. Lead-free reliability in automotive environments. Testability of lead-free printed circuit assembliesEmphasizing practical knowledge of lead-free soldering rather than theory, Lead-Free Solder Process Development is written by experts who are or who have been heavily involved in lead-free implementation at the product level. Being an up-to-date book on this changing field, it is an essential read for engineers in the industry who are or will be migrating to lead-free soldering. 606 $aLead-free electronics manufacturing processes 606 $aSolder and soldering 615 0$aLead-free electronics manufacturing processes. 615 0$aSolder and soldering. 676 $a621.38104 676 $a621.9/77 700 $aBath$b Jasbir$01652157 701 $aHandwerker$b Carol A$01342255 701 $aHenshall$b Gregory Arthur$01652158 801 0$bCaBNVSL 801 1$bCaBNVSL 801 2$bCaBNVSL 906 $aBOOK 912 $a9910830099503321 996 $aLead-free solder process development$94002614 997 $aUNINA