LEADER 02396nam 2200505 450 001 9910830046703321 005 20220920221729.0 010 $a1-119-41833-X 010 $a1-119-41834-8 010 $a1-119-41832-1 024 7 $a10.1002/9781119418344 035 $a(MiAaPQ)EBC6826401 035 $a(Au-PeEL)EBL6826401 035 $a(CKB)20133957500041 035 $a(OCoLC)1289372266 035 $a(OCoLC)1268544247 035 $a(OCoLC-P)1268544247 035 $a(CaSebORM)9781119418313 035 $a(EXLCZ)9920133957500041 100 $a20220827d2022 fy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aElectronic packaging science and technology /$fKing-Ning Tu, Chih Chen, Hung-Ming Chen 210 1$aNewark :$cJohn Wiley & Sons,$d[2022] 210 4$dİ2022 215 $a1 online resource (330 pages) 311 08$aPrint version: Tu, King-Ning Electronic Packaging Science and Technology Newark : John Wiley & Sons, Incorporated,c2021 9781119418313 327 $aElectronic packaging. 330 $a"This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"--$cProvided by publisher. 606 $aElectronic packaging 615 0$aElectronic packaging. 676 $a621.381046 700 $aTu$b K. N$g(King-Ning),$f1937-$01680458 702 $aChen$b Chih$f1970- 702 $aChen$b Hung-Ming 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910830046703321 996 $aElectronic packaging science and technology$94049175 997 $aUNINA