LEADER 03350nam  2200625Ia 450 
001 9910825844003321
005 20240410110606.0
010   $a1-280-54757-X
010   $a9786610547579
010   $a1-84663-011-8
035   $a(CKB)1000000000242843
035   $a(EBL)267393
035   $a(OCoLC)71174790
035   $a(SSID)ssj0000671747
035   $a(PQKBManifestationID)11384635
035   $a(PQKBTitleCode)TC0000671747
035   $a(PQKBWorkID)10625146
035   $a(PQKB)11705436
035   $a(MiAaPQ)EBC267393
035   $a(Au-PeEL)EBL267393
035   $a(CaPaEBR)ebr10132649
035   $a(CaONFJC)MIL54757
035   $a(OCoLC)133162498
035   $a(EXLCZ)991000000000242843
100   $a20000815d2006      uy         0
101 0 $aeng
135   $aur|n|---|||||
181   $ctxt
182   $cc
183   $acr
200 00$aAdvanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging$b[electronic resource] /$fguest editors Christopher Bailey and Johan Liu
205   $a1st ed.
210   $aBradford, England $cEmerald Group Publishing$dc2006
215   $a1 online resource (72 p.)
225 0 $aSoldering & surface mount technology ;$vv.18, no. 2
300   $aDescription based upon print version of record.
311   $a1-84663-010-X 
327   $aCover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
327   $aFinite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary
330   $aThis issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i
410  0$aSoldering & surface mount technology ;$vv.18, no. 2.
606   $aManufacturing processes
606   $aElectronic packaging
615  0$aManufacturing processes.
615  0$aElectronic packaging.
676   $a621.381/046
701   $aBailey$b Christopher$01617464
701   $aLiu$b Johan$01617465
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910825844003321
996   $aAdvanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging$93948657
997   $aUNINA