LEADER 10843nam 22004693 450 001 9910825838103321 005 20211214151323.0 035 $a(CKB)4100000012153267 035 $a(MiAaPQ)EBC6824115 035 $a(Au-PeEL)EBL6824115 035 $a(BIP)081004521 035 $a(OCoLC)1288427904 035 $a(EXLCZ)994100000012153267 100 $a20211214d2021 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aBogatin's Practical Guide to Prototype Breadboard and PCB Design 210 1$aNorwood :$cArtech House,$d2021. 210 4$dİ2021. 215 $a1 online resource (521 pages) 311 $a1-63081-962-X 311 $a1-63081-848-8 327 $aBOGATIN'S PRACTICAL GUIDE to PROTOTYPE BREADBOARD and PCB DESIGN -- Table of Contents -- Chapter 1 A Getting-Started Guide -- 1.1 Who This Book Is For -- 1.2 Getting Stuff Done -- 1.3 Cost-Performace Trade-offs -- 1.4 Errors, Best Practices, and Habits -- 1.5 Learn to Design-in Success -- 1.6 A Getting-Started Guide for Signal Integrity -- 1.7 The Seven-Step Process -- 1.8 Risk Management and Mitigation -- 1.9 Two Risk Management Design Strategies -- 1.0 Master of Murphy's Law -- 1.11 Proof of Concept -- 1.12 Practice Questions -- Chapter 2 PCB Technology -- 2.1 PCB, PWB, or PCA? -- 2.2 Physical Design of a PCB -- 2.3 Vias Technologies -- 2.4 Thermal and Thermal Relief Vias -- 2.5 Other Layers -- 2.6 The Soldermask Layer -- 2.7 Surface Finishes -- 2.8 The Silk Screen -- 2.9 What the Fab Vendor Needs -- 2.10 Practice Questions -- Chapter 3 Signal Integrity and Interconnects -- 3.1 Transparent Interconnects -- 3.2 When Interconnets are NOT Transparent -- 3.3 Where Signal Integrity Lives -- 3.4 Six Categories of Electrical Noise -- 3.5 Families of SI/PI/EMI Problems -- 3.6 In Principle and In Practice -- 3.7 Net Classes and Interconnect Problems -- 3.9 Design for X -- 3.10 Practice Questions -- Chapter 4 Electrical Properties of Interconnects -- 4.1 Ideal vs Real Circuit Elements -- 4.2 Equivalent Electrical Circuit Models -- 4.3 Parasitic Extraction of R, L, and C Elements -- 4.4 Describing Cross Talk -- 4.5 Estimating Mutual Inductance -- 4.6 Training Your Engineer's Mind's Eye -- 4.7 Electrically Long Interconnects -- 4.8 Electrically Short and Electrically Long -- 4.9 Practice Questions -- Chapter 5 Trace Width Considerations: Max Current -- 5.1 Best design practices -- 5.2 Minimum Fabrication Trace Width -- 5.3 Copper Thickness as Ounces of Copper -- 5.4 Maximum Current Handling of a Trace -- 5.5 Maximum Current Through a Via. 327 $a5.6 Thermal Runaway with Constant Current -- 5.7 Practice Questions -- Chapter 6 Trace Width Considerations: Series Resistance -- 6.1 Resistance of Any Uniform Conductor -- 6.2 Sheet Resistance of a Copper Layer -- 6.3 Measuring Very Low Resistances -- 6.4 Voltage Drop Across Traces -- 6.5 The Thevenin Model of a Voltage Source -- 6.6 How Much Trace Resistance Is too Much? -- 6.7 The Resistance of a Via -- 6.8 Resistance of a Thermal Relief Via -- 6.9 Practice Questions -- Chapter 7 The Seven Steps in Creating a PCB -- 7.1 Step 1: Plan of Record -- 7.2 Step 2: Create the BOM -- 7.3 Step 3: Complete the Schematic -- 7.4 Step 4: Complete the Layout, Order the Parts -- 7.5 Steps 5 and 6: Assembly and Bring-Up -- 7.6 Step 7: Documentation -- 7.7 Practice Questions -- Chapter 8 Step 1, POR: Risk Mitigation -- 8.1 Visualize the Entire Project Before You Begin -- 8.2 Avoid Feature Creep -- 8.3 Estimate Everything You Can -- 8.4 Preliminary BOM: Critical Components -- 8.5 Risk Assessment -- 8.6 Risk Mitigation: Tented Vias -- 8.7 Risk Mitigation: Qualified Parts -- 8.8 Practice Questions -- Chapter 9 Risk Reduction: Datasheets, Reverse Engineering, and Component Selection -- 9.1 Take Responsibility for Your Design -- 9.2 Reducing the Risk of a Design Problem -- 9.3 Understand Your Circuit -- 9.4 Read Datasheets Critically -- 9.5 Build Simple Evaluation Prototypes -- 9.6 Reverse Engineer Components -- 9.7 Reuse Parts -- 9.8 Practice Questions -- Chapter 10 Risk Reduction: Virtual and Real Prototypes -- 10.1 Getting Started with Circuit Simulation -- 10.2 Practice Safe Simulation -- 10.3 Simulating a 555 Circuit -- 10.4 Purchase an Evaluation Board -- 10.5 Real Prototypes with Modules -- 10.6 Practice Questions -- Chapter 11 Risk Reduction: Prototyping with a Solderless Breadboard -- 11.1 Build a Real Prototype -- 11.2 Solderless Breadboards for POC. 327 $a11.3 Features of a Solderless Breadboard -- 11.4 Bandwidth Limitations -- 11.5 A Simple Breakout Board -- 11.6 The Mini Solderless Breadboard -- 11.7 Best Wiring Habits -- 11.8 Habit #1: Consistent Column Assignments -- 11.9 Habit #2: Color Code the Wires -- 11.10 Habit #3: Keep Signal Traces Short -- 11.11 Habit #4: Avoid a Shared Return Path -- 11.12 Habit #5: Route Signal-Return Pairs -- 11.13 Habit #6: Keep Component Leads Short -- 11.14 Practice Questions -- Chapter 12 Switching Noise and Return Path Routing -- 12.1 The Origin of Switching Noise -- 12.2 Signal-Return Path Loops -- 12.3 Where Does Return Current Flow? -- 12.4 A Plane as a Return Path -- 12.5 Ground -- 12.6 Avoid Gaps in the Return Plane -- 12.7 Summary of the Best design practices -- 12.8 Practice Questions -- Chapter 13 Power Delivery -- 13.1 Origin of Power Rail Switching Noise -- 13.2 Calculating Loop Inductance -- 13.3 Measuring PDN Switching Noise -- 13.4 The Role of Decoupling Capacitors -- 13.5 Where Do Decoupling Capacitors Go? -- 13.6 The Power Delivery Path -- 13.7 Inrush Current -- 13.8 Summary of the Eight Habits for Using a SSB -- 13.9 Practice Questions -- Chapter 14 Design for Performance: The PDN on a PCB -- 14.1 VRM specifications -- 14.2 Voltage Regulator Module -- 14.3 Self- and Mutual-Aggression Noise -- 14.4 Power and Ground Loop Inductance -- 14.5 Decoupling Capacitors -- 14.6 A Decoupling Capacitor Myth -- Part 1 -- 14.7 A Decoupling Capacitor Myth -- Part 2 -- 14.8 Routing for Power Distribution -- 14.9 Ferrite Beads -- 14.10 Summary of the Best design practices -- 14.11 Practice Questions -- Chapter 15 Risk Reduction: Design for Bring-Up -- 15.1 Test is Too General a Term -- 15.2 What Does It Mean to "Work"? -- 15.3 Design for Bring-Up -- 15.4 Add Design for Bring-Up Features -- 15.5 Jumper Switches -- 15.6 LED indicators -- 15.7 Test Points. 327 $a15.8 The Power Rail as a Diagnostic -- 15.9 Practice Questions -- Chapter 16 Risk Reduction: Design Reviews -- 16.1 The Preliminary Design Review -- 16.2 The Critical Design Review -- 16.3 DRC for DFM in the CDR -- 16.4 DRC for Signal Integrity -- 16.5 Layout Review -- 16.6 Practice Questions -- Chapter 17 Step 2: Surface-Mount or Through-Hole Parts -- 17.1 Through-Hole and Surface-Mount -- 17.2 Types of SMT Parts -- 17.3 Integrated Circuit Components -- 17.4 Practice Questions -- Chapter 18 Finding the One Part in a Million -- 18.1 An Important Selection Process -- 18.2 Trade-offs in Selecting Parts -- 18.3 The Search Order to Select a Part -- 18.4 Selecting Resistors -- 18.5 Selecting Capacitors -- 18.6 The BOM -- 18.7 Summary of the Best Design Practices -- 18.8 Selecting Parts for Automated Assembly -- 18.9 Practice Questions -- Chapter 19 Step 3: Schematic Capture and Final BOM -- 19.1 Picking a Project Name -- 19.2 Schematic Capture -- 19.3 Take Ownership of Reference Designs -- 19.4 Add Options to Your Schematic -- 19.5 Best design practices for Schematic Entry -- 19.6 Design Review and ERC -- 19.7 Practice Questions -- Chapter 20 Step 4: Layout - Setting Up the Board -- 20.1 Layout -- 20.2 Board Dimensions -- 20.3 The Layers in a Board Stack -- 20.4 Negative and Positive Layers -- 20.5 Examples of Some Fab Shop DFM Features -- 20.6 Setting Up Design Constraints -- 20.7 Thermal Reliefs in Pads and Vias -- 20.8 Set Up Board Size and Keepout Layer -- 20.9 Practice Questions -- Chapter 21 Floor Planning and Routing Priority -- 21.1 Part Placement -- 21.2 The Order of Placement and Routing -- 21.3 First Priority: Ground Plane on the Bottom Layer -- 21.4 Second Priority: Decoupling Capacitors -- 21.5 Third Priority: Ground Connections -- 21.6 Fourth Priority: Digital Signals, Congested Signals -- 21.7 Fifth Priority: Power Paths. 327 $a21.8 The Silk Screen -- 21.9 Check the Soldermask -- 21.10 Soldermask Color -- 21.11 Layout - Critical Design Review -- 21.12 Practice Questions -- Chapter 22 Six Common Misconceptions about Routing -- 22.1 Myth #1: Avoid 90 Deg Corners -- 22.2 Myth #2: Add Copper Pour on Signal Layers -- 22.3 Myth #3: Use Different Value Decoupling Capacitors -- 22.4 Myth #4: Split Ground Plan -- 22.5 Myth #5: Use Power Planes -- 22.6 Myth #6: Use 50 Ohm Impedance Traces -- 22.7 Practice Questions -- Chapter 23 Four-Layer Boards -- 23.1 Two-Layer Stack-Ups -- 23.2 A 4-Layer Board -- 23.3 Four-Layer Stack-Up Options -- 23.4 Stack-Up Options with Two Planes -- 23.5 The Recommended 4-Layer Stack-Up -- 23.6 When Signals Change Return Planes -- 23.7 Practice Questions -- Chapter 24 Release the Board to the Fab Shop -- 24.1 Gerber Files -- 24.2 Cost Adders -- 24.3 Board Release Checklist -- 24.4 Practice Questions -- Chapter 25 Step 6: Bring-Up -- 25.1 Does Your Widget Work? -- 25.2 Prototype or Production Testing -- 25.3 Design for Bring-Up -- 25.4 Find the Root Cause -- 25.5 Problems to Expect -- 25.6 Troubleshoot Like a Detective -- 25.7 Trick #1: Recreate the Problem -- 25.8 Trick #2: Seen This Problem Before? -- 25.9 Trick #3: Round Up the Usual Suspects -- 25.10 Trick #4: Three Possible Explanations -- 25.11 A Methodology -- 25.12 Forensic Analysis -- 25.13 Coding Issues -- 25.14 Practice Questions -- Chapter 26 Step 7: Documentation -- Chapter 27 Concluding Comments -- Chapter 28 About Eric Bogatin. 330 8 $aThis book focuses on the understanding of the Cylindrical Dielectric Resonator Antennas (CDRA). The book introduces the fundamentals of DRA, CDRA, identifying the modes in a CDRA, excitation techniques and recent advancements pertaining to the research of the CDRAs. The latest trends in the field are discussed, including wide bandwidth of operation, high gain, modal stability, mode and impedance matching techniques, Circularly Polarized CDRAs, beam forming and MIMO applications for modern wireless systems. The experimental validation, testing, fabrication methods and machining to achieve cylindrical and its reformed shapes are also presented. 606 $aPrinted circuits 615 0$aPrinted circuits. 676 $a621.381531 700 $aBogatin$b Eric$0478629 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910825838103321 996 $aBogatin's Practical Guide to Prototype Breadboard and PCB Design$93990927 997 $aUNINA LEADER 03976nam 22005175 450 001 9910254087803321 005 20200701152322.0 010 $a3-319-39799-0 024 7 $a10.1007/978-3-319-39799-3 035 $a(CKB)3710000000872812 035 $a(DE-He213)978-3-319-39799-3 035 $a(MiAaPQ)EBC6313221 035 $a(MiAaPQ)EBC5588393 035 $a(Au-PeEL)EBL5588393 035 $a(OCoLC)960727402 035 $a(PPN)195510178 035 $a(EXLCZ)993710000000872812 100 $a20160914d2016 u| 0 101 0 $aeng 135 $aurnn#008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aDifferential Geometry of Curves and Surfaces /$fby Kristopher Tapp 205 $a1st ed. 2016. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2016. 215 $a1 online resource (VIII, 366 p. 186 illus. in color.) 225 1 $aUndergraduate Texts in Mathematics,$x0172-6056 300 $aIncludes index. 311 $a3-319-39798-2 327 $aIntroduction -- Curves -- Additional topics in curves -- Surfaces -- The curvature of a surface -- Geodesics -- The Gauss?Bonnet theorem -- Appendix A: The topology of subsets of Rn -- Recommended excursions -- Index. 330 $aThis is a textbook on differential geometry well-suited to a variety of courses on this topic. For readers seeking an elementary text, the prerequisites are minimal and include plenty of examples and intermediate steps within proofs, while providing an invitation to more excursive applications and advanced topics. For readers bound for graduate school in math or physics, this is a clear, concise, rigorous development of the topic including the deep global theorems. For the benefit of all readers, the author employs various techniques to render the difficult abstract ideas herein more understandable and engaging. Over 300 color illustrations bring the mathematics to life, instantly clarifying concepts in ways that grayscale could not. Green-boxed definitions and purple-boxed theorems help to visually organize the mathematical content. Color is even used within the text to highlight logical relationships. Applications abound! The study of conformal and equiareal functions is grounded in its application to cartography. Evolutes, involutes and cycloids are introduced through Christiaan Huygens' fascinating story: in attempting to solve the famous longitude problem with a mathematically-improved pendulum clock, he invented mathematics that would later be applied to optics and gears. Clairaut?s Theorem is presented as a conservation law for angular momentum. Green?s Theorem makes possible a drafting tool called a planimeter. Foucault?s Pendulum helps one visualize a parallel vector field along a latitude of the earth. Even better, a south-pointing chariot helps one visualize a parallel vector field along any curve in any surface. In truth, the most profound application of differential geometry is to modern physics, which is beyond the scope of this book. The GPS in any car wouldn?t work without general relativity, formalized through the language of differential geometry. Throughout this book, applications, metaphors and visualizations are tools that motivate and clarify the rigorous mathematical content, but never replace it. . 410 0$aUndergraduate Texts in Mathematics,$x0172-6056 606 $aGeometry, Differential 606 $aDifferential Geometry$3https://scigraph.springernature.com/ontologies/product-market-codes/M21022 615 0$aGeometry, Differential. 615 14$aDifferential Geometry. 676 $a516.36 700 $aTapp$b Kristopher$4aut$4http://id.loc.gov/vocabulary/relators/aut$0755882 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910254087803321 996 $aDifferential geometry of curves and surfaces$91523267 997 $aUNINA