LEADER 05435nam 2200661 450 001 9910824877703321 005 20230125185305.0 010 $a1-5231-1759-1 010 $a1-60807-214-2 035 $a(CKB)2670000000133996 035 $a(EBL)829302 035 $a(OCoLC)769344000 035 $a(SSID)ssj0000593578 035 $a(PQKBManifestationID)12186399 035 $a(PQKBTitleCode)TC0000593578 035 $a(PQKBWorkID)10746558 035 $a(PQKB)11720477 035 $a(Au-PeEL)EBL829302 035 $a(CaPaEBR)ebr10522165 035 $a(CaBNVSL)mat09100714 035 $a(IEEE)9100714 035 $a(MiAaPQ)EBC829302 035 $a(EXLCZ)992670000000133996 100 $a20200730d2011 uy 101 0 $aeng 135 $aurcn||||||||| 181 $ctxt 182 $cc 183 $acr 200 10$aSubstrate Surface Preparation Handbook 210 1$aNorwood :$cArtech House,$d2011. 210 2$a[Piscataqay, New Jersey] :$cIEEE Xplore,$d[2011] 215 $a1 online resource (196 p.) 225 1 $aArtech House applied photonics series 300 $aDescription based upon print version of record. 311 $a1-60807-213-4 320 $aIncludes bibliographical references and index. 327 $aSubstrate SurfacePreparation Handbook; Contents; Foreword; Preface; 1 Introduction; 1.1 Choosing a Process; 1.2 Definitions of Processes Used in This Book; 1.3 Lapping, Grinding, and Polishing Abrasives; 2 Preparation: Before the Start; 2.1 Plates and Measurement; 2.1.1 Plate Measurement; 2.1.2 Maintaining Plate Shape; 2.2 Lapping Plates; 2.2.1 Glazing; 2.3 Polishing Plates; 2.4 Polishing Surfaces: Care and Conditioning; 2.5 Baseplates for Polishing; 2.5.1 Baseplate Materials; 2.6 The Use of Smoothing Blocks; 2.7 Jigs; 2.7.1 When to Use a Jig; 2.7.2 Jig Balance; 2.7.3 Jig Maintenance. 327 $a2.8 Sample Mounting2.8.1 Vacuum Mounting; 2.8.2 Wax Mounting; 2.8 -- Automated Bonding; 2.8.4 Evaporated Wax Films; 2.8.5 Surface Tension Mounting; 2.8.6 Epoxy Bonding; 2.9 Sample Viewing and Assessment; 2.10 Plate and Sample Flatness Control; 2.10.1 Wafer Distortion; 2.11 Conclusion; References; 3 Lapping; 3.1 The Lapping Process; 3.1.1 If the Stock Removal Is Too Slow; 3.1.2 If the Stock Removal Is Too Fast; 3.2 Plate Shape Monitoring; 3.3 Scratching; 3.4 Smoothing; References; 4 Polishing; 4.1 Introduction; 4.2 Sample Load; 4.3 Abrasives; 4.4 Edge Polishing; 4.5 Slurry Flow Rate. 327 $a4.6 Grit Sizes4.7 Aligning the Sample; 4.8 The Polishing Run; 4.8.1 Before the Start; 4.8.2 Monitoring Progress; 4.9 Jig Rotation; 4.10 Sample Surface Shape and In-Process Alignment; 4.11 Chemical Polishing; 4.12 Chemomechanical Polishing; 4.13 Fluid Jet Polishing: Future Developments; References; 5 Specific Processes and Materials; 5.1 Geology; 5.2 Hard Materials; 5.2.1 Lapping Hard Materials; 5.2.2 Polishing Hard Materials; 5.3 Water-Soluble Materials; 5.4 Electro-Optic Materials; 5.4.1 Infrared and Electro-Optic Materials; 5.4.2 Processing Infared and Electro-Optic Materials; References. 327 $a6 Specialized Techniques6.1 Diamond Machining: Introduction; 6.1.1 Diamond Machining of Ductile Materials; 6.1.2 Diamond Machining of Brittle Materials; 6.2 Sawing; 6.2.1 Wire Saws; 6.2.2 High-Speed Saws; 6.2.3 Annular Saws; References; 7 Surface; 7.1 The Lapped Surface Finish; 7.2 Subsurface Damage; 7.3 Understanding Surface Finish; 7.3.1 Cutoff; 7.3.2 Stylus Radius; Reference; 8 Optics; 8.1 Glass; 8.2 Processing with Pitch; 8.3 Pitch Alternatives; 8.4 Spherical Surfaces; 8.5 Blocking Spherical Components; 8.6 Specifying Diamond Tooling; 8.7 Testing of Optical Components; References. 327 $a9 Semiconductor Device DeconstructionReferences; 10 Metallurgical Polishing and Microscopy; 10.1 Processing; 10.1.1 Process Stages; 10.2 Examination; 10.3 Microscope Setup; References; 11 Laboratory Setup; 11.1 Equipment Locations; 11.2 Laboratory Layout and Dimensions; 11.3 Optimizing the Process Route; 11.4 Sample Cleaning; 11.5 Safety Regulations; 11.6 Lab Environment; 11.7 Consumables; References; 12 Using Interferometry; 12.1 Basic Principles; 12.2 Analysis of Fringe Patterns; 12.3 Normal and Grazing Incidence; 12.4 Introducing the Workshop Interferometer; References; Bibliography. 330 $aSubstrate Surface Preparation serves as a practical, one-stop reference, covering the technologies developed to produce flat surfaces with nanometer accuracy for the subsequent building of semiconductor devices and integrated circuits. This hands-on resource offers you detailed guidance in the entire substrate surface preparation process, from lapping and polishing ... to specialized techniques and surface finishing. Supported with over 125 illustrations, this unique book provides you with a complete understanding of important maintenance methods and the full range of equipment available in the fi. 410 0$aArtech House applied photonics series. 606 $aOptical materials$xSurfaces 606 $aGlass grinding and polishing 615 0$aOptical materials$xSurfaces. 615 0$aGlass grinding and polishing. 676 $a621.3815 676 $a671 700 $aRobertson$b Max$01680332 801 0$bCaBNVSL 801 1$bCaBNVSL 801 2$bCaBNVSL 906 $aBOOK 912 $a9910824877703321 996 $aSubstrate Surface Preparation Handbook$94049006 997 $aUNINA