LEADER 02834nam 2200445 450 001 9910824824003321 005 20230125212544.0 010 $a1-63081-435-0 035 $a(CKB)3710000001178072 035 $a(MiAaPQ)EBC4845591 035 $a(CaBNVSL)mat09101090 035 $a(IEEE)9101090 035 $a(EXLCZ)993710000001178072 100 $a20200729d2016 uy 101 0 $aeng 135 $aurcnu|||||||| 181 $2rdacontent 182 $2rdamedia 183 $2rdacarrier 200 10$aMicrowave material applications $edevice miniaturization and integration /$fDavid B. Cruickshank 210 1$aNorwood, Massachusetts :$cArtech House,$d[2017] 210 2$a[Piscataqay, New Jersey] :$cIEEE Xplore,$d[2016] 215 $a1 online resource (220 pages) $cillustrations 225 1 $aArtech House microwave library 311 $a1-63081-102-5 311 $a1-63081-101-7 320 $aIncludes bibliographical references at the end of each chapters and index. 330 3 $aThis comprehensive new resource based on the classic Artech House title, Microwave Materials for Wireless Applications, introduces the use of new microwave materials for passive devices including ferrites, magnetization garnets, dielectric materials, and absorbers for wireless and antenna applications. This book explores a new set of magnetic and dielectric materials that assist with size reduction of passive devices such as ferrite isolators and circulators. Revised data on the applications of absorbers, including examples of different combinations of magnetic, dielectric, and absorber materials into integrated devices is presented. Meta-materials for antennas and potential antenna integration onto soft boards or LTCC filter technologies using tunable devices with new materials are covered.nnProfessionals learn how new material designs use properties of certain ions in oxide compounds to reduce their physical size, including in cellular base stations designed for 4G and 5G cell phone communication systems. This book exhibits how the integration of new materials into cellular systems using common transmission lines will further save size and reduce complexity. New technologies are presented demonstrating the use of sol-gel processing and ceramic processing in the use of low temperature co-fired ceramics, plastic molding, and 3D printing demonstrating improved device designs.$cPublisher abstract. 410 0$aArtech House microwave library. 606 $aMicrowave devices$xMaterials 615 0$aMicrowave devices$xMaterials. 676 $a621.38133 700 $aCruickshank$b David B.$01607460 801 0$bCaBNVSL 801 1$bCaBNVSL 801 2$bCaBNVSL 906 $aBOOK 912 $a9910824824003321 996 $aMicrowave material applications$93933764 997 $aUNINA