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100   $a20201009d2020      uy             0
101 0 $aeng
135   $aurcnu||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 00$aLead-free soldering process development and reliability /$fedited by Jasbir Bath
210  1$aHoboken, New Jersey :$cWiley,$d2020.
215   $a1 online resource (515 pages)
225 1 $aWiley Series in Quality & Reliability Engineering
311   $a1-119-48203-8 
320   $aIncludes bibliographical references and index.
410  0$aWiley series in quality & reliability engineering.
606   $aElectronic packaging
606   $aSolder and soldering
615  0$aElectronic packaging.
615  0$aSolder and soldering.
676   $a621.381/046
702   $aBath$b Jasbir
801  0$bMiAaPQ
801  1$bMiAaPQ
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906   $aBOOK
912   $a9910824582703321
996   $aLead-free soldering process development and reliability$94086168
997   $aUNINA