LEADER 05582nam 2200673 450 001 9910824188203321 005 20220103163348.0 035 $a(CKB)2670000000617882 035 $a(EBL)2056911 035 $a(SSID)ssj0001548973 035 $a(PQKBManifestationID)16154235 035 $a(PQKBTitleCode)TC0001548973 035 $a(PQKBWorkID)14802857 035 $a(PQKB)10306304 035 $a(Au-PeEL)EBL2056911 035 $a(CaPaEBR)ebr11058676 035 $a(CaONFJC)MIL788494 035 $a(OCoLC)910159095 035 $a(MiAaPQ)EBC2056911 035 $a(EXLCZ)992670000000617882 100 $a20150123h20152015 uy| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aRobust design of microelectronics assemblies against mechanical shock, temperature and moisture /$fE-H Wong, Y.-W Mai 210 1$aBoston, MA :$cElsevier,$d[2015] 210 4$dİ2015 215 $a1 online resource (477 p.) 225 1 $aWoodhead Publishing series in electronic and optical materials,$x2050-1501 ;$vnumber 81 300 $aDescription based upon print version of record. 311 $a0-85709-911-6 311 $a1-84569-528-3 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Related titles; Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and MoistureWoodhead Publishing Series i ...; Copyright; Contents; Woodhead Publishing Series in Electronic and Optical Materials; Foreword; Preface; 1 - Introduction; 1.1 Introduction to microelectronic packaging; 1.2 Introduction to robust design; 1.3 Organisation of the book; References; Part 1 - Advances in robust design against temperature-induced failures; 2 - Robust design of microelectronic assemblies against mismatched thermal expansion; 2.1 Introduction; 2.2 Fundamentals 327 $a2.3 Comprehensive analysis of a bilayer structure2.4 Microelectronic assembly as a sandwich structure with a continuous bonding layer; 2.5 PCB assembly as a sandwich structure with a layer of solder joints; References; 2. Appendix: prior published works in thermoelasticity; 2. Nomenclature; 2. Mathematical symbols; 3 - Advances in creep-fatigue modelling of solder joints; 3.1 Introduction; 3.2 Life-prediction models for creep-fatigue; 3.3 The unified equation; 3.4 Self-validations and benchmarking; 3.5 Applications; References 327 $aPart 2 - Advances in robust design against moisture-induced failures4 - Moisture properties and their characterisations; 4.1 Introduction; 4.2 Thermodynamics of water; 4.3 Sorption and its characterisation; 4.4 Diffusivity and its characterisation; 4.5 Hygroscopic swelling and its characterisation; References; 5 - Advances in diffusion and vapour pressure modelling; 5.1 The discontinuity of concentration; 5.2 The fractional saturation; 5.3 Diffusion under time-varying temperature and pressure; 5.4 Advances in vapour pressure modelling; References; Part 3 - Robust design against drop impact 327 $a6 - The physics of failure of portable electronic devices in drop impact6.1 Product drop testing; 6.2 The physics of failure; References; 7 - Subsystem testing of solder joints against drop impact; 7.1 Board-level testing; 7.2 Component-level testing; References; 8 - Fatigue resistance of solder joints: strain-life representation; 8.1 Introduction; 8.2 Design of test specimens; 8.3 Fatigue resistance equations: materials; 8.4 Fatigue resistance equations: frequency; 8.5 Fatigue resistance equations: environment; References; 9 - Fatigue crack growth in solder joints at high strain rate 327 $a9.1 Introduction9.2 Establishment of continuous crack growth tracking capability; 9.3 Crack propagation characteristics: board-level drop shock test; 9.4 Crack propagation characteristics: high-speed cyclic bending test; 9.5 Three-dimensional fracture mechanics modelling of the crack front; 9.6 Crack propagation in the solder joints of a mobile phone experiencing drop impact; References; 10 - Dynamic deformation of a printed circuit board in drop-shock; 10.1 Introduction; 10.2 Vibration of a test board in the JESD22-B111 drop-shock test 327 $a10.3 Analytical solutions for a spring-mass system subjected to half-sine shock 330 $aRobust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful progr 410 0$aWoodhead Publishing series in electronic and optical materials ;$vno 81. 606 $aMicroelectronics$xDesign 606 $aIndustrial design 606 $aRobust control 615 0$aMicroelectronics$xDesign. 615 0$aIndustrial design. 615 0$aRobust control. 676 $a621.381046 700 $aWong$b E- H.$01650605 702 $aMai$b Y.-W. 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910824188203321 996 $aRobust design of microelectronics assemblies against mechanical shock, temperature and moisture$94000054 997 $aUNINA