LEADER 05248nam 2200649Ia 450 001 9910823730503321 005 20240410141857.0 010 $a1-281-00635-1 010 $a9786611006358 010 $a0-08-049307-6 035 $a(CKB)1000000000350304 035 $a(EBL)294676 035 $a(OCoLC)476060261 035 $a(SSID)ssj0000246322 035 $a(PQKBManifestationID)11208523 035 $a(PQKBTitleCode)TC0000246322 035 $a(PQKBWorkID)10181757 035 $a(PQKB)11362793 035 $a(Au-PeEL)EBL294676 035 $a(CaPaEBR)ebr10186221 035 $a(CaONFJC)MIL100635 035 $a(MiAaPQ)EBC294676 035 $a(EXLCZ)991000000000350304 100 $a20040702d2005 fy 0 101 0 $aeng 135 $aurcn||||||||| 181 $ctxt 182 $cc 183 $acr 200 10$aSintering $edensification, grain growth, and microstructure /$fSuk-Joong L. Kang 205 $a1st ed. 210 $aAmsterdam ;$aBoston ;$aLondon $cElsevier Butterworth-Heinemann$d2005 215 $a1 online resource (279 p.) 300 $aDescription based upon print version of record. 311 $a0-7506-6385-5 320 $aIncludes bibliographical references and index. 327 $aCover; Front matter; Half Title Page; Title Page; Copyright; CONTENTS; PREFACE; PART I: BASIS OF SINTERING SCIENCE; 1. SINTERING PROCESSES; 1.1 WHAT IS SINTERING?; 1.2 CATEGORIES OF SINTERING; 1.3 DRIVING FORCE AND BASIC PHENOMENA; 1.4 SINTERING VARIABLES; 2. THERMODYNAMICS OF THE INTERFACE; 2.1 SURFACE ENERGY AND ADSORPTION; 2.2 SURFACE TENSION AND SURFACE ENERGY; 2.3 THERMODYNAMICS OF CURVED INTERFACES; 3. POLYCRYSTALLINE MICROSTRUCTURES; 3.1 INTERFACIAL TENSION AND MICROSTRUCTURE; 3.2 SINGLE-PHASE MICROSTRUCTURES; 3.3 MULTIPHASE MICROSTRUCTURES; PROBLEMS 327 $aGENERAL REFERENCES FOR SINTERING SCIENCE REFERENCES; PART II: SOLID STATE SINTERING MODELS AND DENSIFICATION; 4. INITIAL STAGE SINTERING; 4.1 TWO-PARTICLE MODEL; 4.2 SINTERING KINETICS; 4.3 SINTERING DIAGRAMS; 4.4 EFFECT OF SINTERING VARIABLES ON SINTERING KINETICS; 4.5 USEFULNESS AND LIMITATIONS OF THE INITIAL STAGE SINTERING THEORY; 5. INTERMEDIATE AND FINAL STAGE SINTERING; 5.1 INTERMEDIATE STAGE MODEL; 5.2 FINAL STAGE MODEL; 5.3 ENTRAPPED GASES AND DENSIFICATION; 5.4 SINTERING PRESSURE AT FINAL STAGE SINTERING; 5.5 POWDER PACKING AND DENSIFICATION; 5.6 PRESSURE-ASSISTED SINTERING 327 $a5.7 CONSTRAINED SINTERING PROBLEMS; REFERENCES; PART III: GRAIN GROWTH; 6. NORMAL GRAIN GROWTH AND SECOND-PHASE PARTICLES; 6.1 NORMAL GRAIN GROWTH; 6.2 EFFECT OF SECOND-PHASE PARTICLES ON GRAIN GROWTH: ZENER EFFECT; 7. GRAIN BOUNDARY SEGREGATION AND GRAIN BOUNDARY MIGRATION; 7.1 SOLUTE SEGREGATION AT GRAIN BOUNDARIES; 7.2 EFFECT OF SOLUTE SEGREGATION ON GRAIN BOUNDARY MIGRATION; 8. INTERFACE MIGRATION UNDER CHEMICAL INEQUILIBRIUM; 8.1 GENERAL PHENOMENA; 8.2 DRIVING FORCE OF DIFFUSION-INDUCED INTERFACE MIGRATION (DIIM); 8.3 QUANTITATIVE ANALYSIS OF DIIM 327 $a8.4 MICROSTRUCTURAL CHARACTERISTICS OF DIIM AND ITS APPLICATION 9. ABNORMAL GRAIN GROWTH; 9.1 PHENOMENOLOGICAL THEORY OF ABNORMAL GRAIN GROWTH IN SINGLE-PHASE SYSTEMS; 9.2 INTERFACIAL ENERGY ANISOTROPY AND ABNORMAL GRAIN GROWTH; 9.3 ABNORMAL GRAIN GROWTH IN CHEMICAL INEQUILIBRIUM; PROBLEMS; REFERENCES; PART IV: MICROSTRUCTURE DEVELOPMENT; 10. GRAIN BOUNDARY ENERGY AND SINTERING; 10.1 THE GRAIN BOUNDARY AS AN ATOM SOURCE; 10.2 EFFECT OF GRAIN BOUNDARY ENERGY ON PORE SHRINKAGE; 11. GRAIN GROWTH AND DENSIFICATION IN POROUS MATERIALS; 11.1 MOBILITY OF AN ISOLATED PORE 327 $a11.2 PORE MIGRATION AND GRAIN GROWTH 11.3 PORE/BOUNDARY SEPARATION; 11.4 MICROSTRUCTURE DEVELOPMENT IN A POROUS COMPACT; 11.5 SCALING LAW AT FINAL STAGE SINTERING; 11.6 MODIFICATION OF THERMAL CYCLE AND MICROSTRUCTURE DEVELOPMENT; PROBLEMS; REFERENCES; PART V: SINTERING OF IONIC COMPOUNDS; 12. SINTERING ADDITIVES AND DEFECT CHEMISTRY; 12.1 POINT DEFECTS IN CERAMICS; 12.2 FORMATION OF POINT DEFECTS BY ADDITIVES; 13. DENSIFICATION AND GRAIN GROWTH IN IONIC COMPOUNDS; 13.1 DIFFUSION AND SINTERING IN IONIC COMPOUNDS; 13.2 ELECTROSTATIC POTENTIAL EFFECT ON INTERFACE SEGREGATION 327 $a13.3 SOLUTE SEGREGATION AND GRAIN BOUNDARY MOBILITY 330 $aSintering is the process of forming materials and components from a powder under the action of thermal energy. It is a key materials science subject: most ceramic materials and many specialist metal powder products for use in key industries such as electronics, automotive and aerospace are formed this way. Written by one of the leading experts in the field, this book offers an unrivalled introduction to sintering and sintering processes for students of materials science and engineering, and practicing engineers in industry. The book is unique in providing a complete grounding in the pr 606 $aSintering 606 $aSintering$vProblems, exercises, etc 615 0$aSintering. 615 0$aSintering 676 $a671.373 676 $a671.373 700 $aKang$b S.-J. L$g(Suk-Joong L.)$0623684 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910823730503321 996 $aSintering$91091355 997 $aUNINA