LEADER 04206nam 2200625Ia 450 001 9910823051103321 005 20200520144314.0 010 $a1-280-63092-2 010 $a9786610630929 010 $a0-08-045562-X 035 $a(CKB)1000000000358059 035 $a(EBL)269949 035 $a(OCoLC)476000281 035 $a(SSID)ssj0000102902 035 $a(PQKBManifestationID)11127527 035 $a(PQKBTitleCode)TC0000102902 035 $a(PQKBWorkID)10061000 035 $a(PQKB)11064467 035 $a(Au-PeEL)EBL269949 035 $a(CaPaEBR)ebr10138376 035 $a(CaONFJC)MIL63092 035 $a(OCoLC)162130017 035 $a(MiAaPQ)EBC269949 035 $a(EXLCZ)991000000000358059 100 $a20050214d2005 fy 0 101 0 $aeng 135 $aurcn||||||||| 181 $ctxt 182 $cc 183 $acr 200 10$aAnalysis and design principles of MEMS devices /$fby Minhang Bao 205 $a1st ed. 210 $aAmsterdam ;$aOxford $cElsevier$dc2005 215 $a1 online resource (327 p.) 300 $aDescription based upon print version of record. 311 $a0-444-51616-6 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Analysis and Design Principles of MEMS Devices; Copyright Page; Preface; Contents; Summary; Chapter 1. Introduction to MEMS devices; 1.1. Piezoresistive pressure sensor; 1.2. Piezoresistive Accelerometer; 1.3. Capacitive Pressure Sensor, Accelerometer and Microphone; 1.4. Resonant Sensor and Vibratory Gyroscope; 1.5. Micro Mechanical Electric and Optical Switches; 1.6. Micro Mechanical Motors; 1.7. Micro Electro Mechanical Systems; 1.8. Analysis and Design principles of MEMS Devices; References; Chapter 2. Mechanics of beam and diaphragm structures 327 $a2.1. Stress and Strain 2.2. Stress and Strain of Beam Structures; 2.3. Vibration Frequency by Energy Method; 2.4. Vibration Modes and the Buckling of a Beam; 2.5. Damped and forced vibration; 2.6. Basic Mechanics of Diaphragms; 2.7. Problems; References; Chapter 3. Air Damping; 3.1. Drag Effect of a Fluid; 3.2. Squeeze-film Air Damping; 3.3. Damping of Perforated Thick Plates; 3.4. Slide-film Air Damping; 3.5. Damping in Rarefied Air; 3.6. Problems; References; Chapter 4. Electrostatic Actuation; 4.1. Electrostatic Forces; 4.2. Electrostatic Driving of Mechanical Actuators 327 $a4.3. Step and Alternative Voltage Driving 4.4. Problems; References; Chapter 5. Capacitive Sensing and Effects of Electrical Excitation; 5.1. Capacitive Sensing Schemes; 5.2. Effects of Electrical Excitation - Static Signal; 5.3. Effects of Electrical Excitation - Step Signal; 5.4. Effects of Electrical Excitation - Pulse Signal; 5.5. Problems; References; Chapter 6. Piezoresistive Sensing; 6.1. Piezoresistance Effect in Silicon; 6.2. Coordinate Transformation of Second Rank Tensors; 6.3.Coordinate Transformation of Piezoresistive Coefficient; 6.4. Piezoresistive Sensing Elements 327 $a6.5. Polysilicon Piezoresistive Sensing Elements6.6. Analyzing Piezoresistive Bridge; 6.7. Problems; References; Answers to the Problems; Subject Index 330 $aSensors and actuators are now part of our everyday life and appear in many appliances, such as cars, vending machines and washing machines. MEMS (Micro Electro Mechanical Systems) are micro systems consisting of micro mechanical sensors, actuators and micro electronic circuits. A variety of MEMS devices have been developed and many mass produced, but the information on these is widely dispersed in the literature. This book presents the analysis and design principles of MEMS devices. The information is comprehensive, focusing on microdynamics, such as the mechanics of beam and diaphragm structu 606 $aMicroelectromechanical systems 606 $aMicrotechnology 615 0$aMicroelectromechanical systems. 615 0$aMicrotechnology. 676 $a621.381 700 $aBao$b Min-Hang$0627427 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910823051103321 996 $aAnalysis and design principles of MEMS devices$91212878 997 $aUNINA