LEADER 05503nam 2200673 450 001 9910819143603321 005 20200520144314.0 010 $a1-118-83134-9 010 $a1-118-83137-3 010 $a1-118-83135-7 035 $a(CKB)3710000000222774 035 $a(EBL)1767917 035 $a(MiAaPQ)EBC1767917 035 $a(DLC) 2014031115 035 $a(Au-PeEL)EBL1767917 035 $a(CaPaEBR)ebr10910126 035 $a(CaONFJC)MIL637378 035 $a(OCoLC)885378211 035 $a(PPN)183563271 035 $a(EXLCZ)993710000000222774 100 $a20140828h20142014 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $2rdacontent 182 $2rdamedia 183 $2rdacarrier 200 00$aAdhesion in microelectronics /$fedited by K. L. Mittal and Tanweer Ahsan 210 1$aHoboken, New Jersey ;$aSalem, Massachusetts :$cScrivener Publishing :$cWiley,$d2014. 210 4$dİ2014 215 $a1 online resource (367 p.) 225 1 $aAdhesion and Adhesives: Fundamental and Applied Aspects 300 $aDescription based upon print version of record. 311 $a1-322-06127-0 311 $a1-118-83133-0 320 $aIncludes bibliographical references and index. 327 $aCover; Title Page; Copyright Page; Contents; Preface; Acknowledgements; Part 1: Adhesion: Fundamentals and Measurement; 1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics; 1.1 Introduction; 1.2 Principles of IETS; 1.2.1 General Overview; 1.2.2 Key Principles of Operation; 1.2.3 IET Spectrometer Design and Implementation; 1.2.4 IET Sample Preparation; 1.3 Application of IETS in Microelectronics; 1.4 Prospects; 1.5 Summary; References; 2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics 327 $a2.1. Introduction2.2 Mechanical Methods; 2.2.1 Commonly Used Qualitative or Semi-quantitative Methods; 2.2.2 Quantitative Methods; 2.3 Laser Based Techniques; 2.3.1 Laser Induced Delamination (LID); 2.3.2 Laser Direct Ablation Induced De-adhesion; 2.3.3 Laser Spallation Technique; 2.4 Summary and Remarks; References; Part 2: Ways to Promote/Enhance Adhesion; 3 Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion; 3.1 Introduction; 3.1.1 Role of Surface Energy for Metal-Polymer Adhesion; 3.1.2 Physical Effects Produced by Covalent Bonding of Metal to Polymer 327 $a3.1.3 Thermal Expansion Coefficients of Metals and Polymers3.1.4 Differences Between Al-Polyolefin and Polyolefin-Al Laminates; 3.1.5 Types of Covalent Metal-Polymer Bonds; 3.1.6 Redox Reactions across the Metal-Polymer Interface; 3.1.7 Reactions of Transition Metals with Aromatic Polymers; 3.1.8 Loss in Anisotropic Orientation of Polymers Caused by Pretreatment or by Contact with Metals; 3.1.9 Combination of Plasma Pretreatment and Metal Deposition; 3.1.10 Thermodynamics; 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules 327 $a3.2.1 Principal Functions of Spacers3.2.2 Ways to Graft Spacer Molecules onto Polyolefin Surfaces; 3.2.3 Grafting of Spacer Molecules onto Monotype Functional Groups at the Polyolefin Surface for Realizing New Interface Design in Metal-Polymer Systems; 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate; 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces; 3.4.1 General; 3.4.2 Introduction of Functional Groups onto Polyolefin Surfaces; 3.4.3 Usual Pretreatment Processes and Their Advantages and Disadvantages 327 $a3.4.4 Use of Adhesion Promoting Layers Deposited by Plasma Polymerization3.4.5 Use of Silanes and Siloxanes; 3.4.6 Other Methods; 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces; 3.5.1 Oxygen Plasma and Wet-chemical Reduction of O-functional Groups to OH Groups; 3.5.2 Underwater Capillary Discharge Plasma or Glow Discharge Electrolysis (GDE); 3.5.3 Electrospray-Ionization Deposition of Ultra-thin Polymer Layers; 3.5.4 Allylamine Plasma Polymerization for Producing NH2 Groups; 3.5.5 Allyl Alcohol Plasma Polymerization for Producing OH Groups 327 $a3.5.6 Acrylic Acid Plasma Polymerization for Producing COOH Groups 330 $aThis comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesi 410 0$aAdhesion and adhesives.$pFundamental and applied aspects. 606 $aMicroelectronic packaging$xMaterials 606 $aAdhesives 606 $aAdhesive joints 615 0$aMicroelectronic packaging$xMaterials. 615 0$aAdhesives. 615 0$aAdhesive joints. 676 $a621.381/046 702 $aMittal$b K. L.$f1945- 702 $aAhsan$b Tanweer 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910819143603321 996 $aAdhesion in microelectronics$93989804 997 $aUNINA