LEADER 05618nam 2200709 450 001 9910818361103321 005 20230725050834.0 010 $a1-283-17798-6 010 $a9786613177988 010 $a1-119-97278-7 010 $a1-119-99729-1 010 $a1-119-99730-5 035 $a(CKB)2550000000041292 035 $a(EBL)697681 035 $a(SSID)ssj0000535870 035 $a(PQKBManifestationID)11373569 035 $a(PQKBTitleCode)TC0000535870 035 $a(PQKBWorkID)10546676 035 $a(PQKB)11581444 035 $a(MiAaPQ)EBC697681 035 $a(OCoLC)746324291 035 $a(EXLCZ)992550000000041292 100 $a20160401h20112011 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aDigital holography for MEMS and microsystem metrology /$fedited by Anand Asundi 210 1$aChichester, England :$cWiley,$d2011. 210 4$dİ2011 215 $a1 online resource (229 p.) 225 1 $aThe Wiley microsystem and nanotechnology series 300 $aDescription based upon print version of record. 311 $a0-470-97869-4 320 $aIncludes bibliographical references at the end of each chapters and index. 327 $aDigital Holography for MEMS and Microsystem Metrology; Contents; About the Editor; Contributors; Series Preface; Acknowledgements; Abbreviations; 1 Introduction; 2 Digital Reflection Holography and Applications; 2.1 Introduction to Digital Holography and Methods; 2.1.1 Holography and Digital Holography; 2.1.2 Digital Recording Mechanism; 2.1.3 Numerical Reconstruction Methods; 2.2 Reflection Digital Holographic Microscope (DHM) Systems Development; 2.2.1 Optical Systems and Methodology; 2.3 3D Imaging, Static and Dynamic Measurements; 2.3.1 Numerical Phase and 3D Measurements 327 $a2.3.2 Digital Holographic Interferometry2.4 MEMS/Microsystems Characterization Applications; 2.4.1 3D Measurements; 2.4.2 Static Measurements and Dynamic Interferometric Measurement; 2.4.3 Vibration Analysis; References; 3 Digital Transmission Holography and Applications; 3.1 Historical Introduction; 3.2 The Foundation of Digital Holography [30]; 3.2.1 Theoretical Analysis of Wavefront Interference; 3.2.2 Digital Hologram Recording and Reconstruction; 3.2.3 Different Numerical Reconstruction Algorithms; 3.3 Digital Holographic Microscopy System 327 $a3.3.1 Digital Holographic Microscopy with Physical Spherical Phase Compensation3.3.2 Lens-Less Common-Path Digital Holographic Microscope; 3.3.3 Common-Path Digital Holographic Microscope; 3.3.4 Digital Holographic Microscopy with Quasi-Physical Spherical Phase Compensation : Light with Long Coherence Length; 3.3.5 Digital Holographic Microscopy with Quasi-Physical Spherical Phase Compensation : Light with Short Coherence Length; 3.4 Conclusion; References; 4 Digital In-Line Holography and Applications; 4.1 Background; 4.2 Digital In-Line Holography; 4.2.1 Recording and Reconstruction 327 $a4.3 Methodology for 2D Measurement of Micro-Particles4.3.1 Numerical Reconstruction, Pre-Processing and Background Correction; 4.3.2 Image Segmentation; 4.3.3 Particle Focusing; 4.3.4 Particle Size Measurement; 4.4 Validation and Performance of the 2D Measurement Method; 4.4.1 Verification of the Focusing Algorithm; 4.4.2 Spherical Beads on a Glass Slide; 4.4.3 Microspheres in a Flowing System Normalized Population; 4.4.4 10 ?m Microspheres Suspension; 4.4.5 Measurement of Microfibers; 4.5 Methodology for 3D Measurement of Micro-Fibers; 4.5.1 Method 1: The 3D Point Cloud Method 327 $a4.5.2 Method 2: The Superimposition Method4.6 Validation and Performance of the 3D Measurement Methods; 4.6.1 Experiment with a Single Fiber; 4.6.2 3D Measurements of Micro-Fibers in Suspension; 4.7 Conclusion; References; 5 Other Applications; 5.1 Recording Plane Division Multiplexing (RDM) in Digital Holography for Resolution Enhancement; 5.1.1 Introduction of the Recording Plane Division Multiplexing Technique; 5.1.1.1 The SM Technique; 5.1.1.2 The ADM Technique; 5.1.1.3 The WDM Technique; 5.1.1.4 The PM Technique; 5.1.2 RDM Implemented in Pulsed Digital Holography for Ultra-Fast Recording 327 $a5.1.2.1 Introduction 330 $aApproaching the topic of digital holography from the practical perspective of industrial inspection, Digital Holography for MEMS and Microsystem Metrology describes the process of digital holography and its growing applications for MEMS characterization, residual stress measurement, design and evaluation, and device testing and inspection. Asundi also provides a thorough theoretical grounding that enables the reader to understand basic concepts and thus identify areas where this technique can be adopted. This combination of both practical and theoretical approach will ensure the 410 0$aWiley microsystem and nanotechnology series. 606 $aMicroelectromechanical systems$xMeasurement 606 $aMicroelectronics$xMeasurement 606 $aHolographic testing 606 $aImage processing$xDigital techniques 615 0$aMicroelectromechanical systems$xMeasurement. 615 0$aMicroelectronics$xMeasurement. 615 0$aHolographic testing. 615 0$aImage processing$xDigital techniques. 676 $a620.1127 676 $a621.381 702 $aAsundi$b Anand 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910818361103321 996 $aDigital holography for MEMS and microsystem metrology$94017910 997 $aUNINA