LEADER 04505nam 2200589 a 450 001 9910817008203321 005 20240416233711.0 010 $a1-280-20336-6 010 $a9786610203369 010 $a0-309-58375-6 010 $a0-585-08463-7 035 $a(CKB)110986584751116 035 $a(OCoLC)43475627 035 $a(CaPaEBR)ebrary10055392 035 $a(SSID)ssj0000222460 035 $a(PQKBManifestationID)11175776 035 $a(PQKBTitleCode)TC0000222460 035 $a(PQKBWorkID)10169814 035 $a(PQKB)11765997 035 $a(MiAaPQ)EBC3376299 035 $a(Au-PeEL)EBL3376299 035 $a(CaPaEBR)ebr10055392 035 $a(OCoLC)923262698 035 $a(EXLCZ)99110986584751116 100 $a19911004d1991 uy 0 101 0 $aeng 135 $aurcn||||||||| 181 $ctxt 182 $cc 183 $acr 200 10$aPlasma processing of materials $escientific opportunities and technological challenges /$fPanel on Plasma Processing of Materials, Plasma Science Committee, Board on Physics and Astronomy, Commission on Physical Sciences, Mathematics, and Applications, National Research Council 205 $a1st ed. 210 $aWashington, D.C. $cNational Academy Press$d1991 215 $a1 online resource (87 p.) 300 $aBibliographic Level Mode of Issuance: Monograph 311 $a0-309-04597-5 327 $aPlasma Processing of Materials: -- Copyright -- Preface -- Acknowledgments -- Contents -- 1 Summary, Findings, Conclusions, And Recommendations -- SUMMARY -- FINDINGS, CONCLUSIONS, AND RECOMMENDATIONS -- 2 Plasma Processing And Low-Energy Plasma Science -- CLASSIFICATION OF PLASMAS -- BRIEF HISTORY OF LOW-ENERGY PLASMA SCIENCE AND TECHNOLOGY -- INDUSTRIAL APPLICATIONS OF PLASMA PROCESSING OF MATERIALS -- INTERFACE BETWEEN BASIC PLASMA SCIENCE AND APPLICATIONS -- SCOPE OF THIS REPORT -- 3 Plasma Processing In The Electronics Industry -- MICROELECTRONICS FABRICATION -- PLASMA ETCHING -- Anisotropy -- Selectivity -- Uniformity -- Damage -- New Materials -- PLASMA DEPOSITION -- Planarization, Filling, and Interconnection -- Surface Modification -- New Materials -- PLASMA CLEANING -- LOW-PRESSURE PLASMA REACTOR TECHNOLOGY -- Single-Wafer Processing -- Process Control -- New Plasma Sources -- Magnetic Confinement -- Downstream Processing -- Modulated Processing -- Clustered Processing -- THERMAL PLASMA REACTOR TECHNOLOGY -- TOWARD FLEXIBLE MICROELECTRONICS MANUFACTURING -- FINDINGS AND CONCLUSIONS -- 4 Scientific Foundation of Plasma Processing -- SURFACE PROCESSES -- Theory and Simulation -- Experimental Studies -- Beam-Surface Experiments -- Ex Situ Analysis -- PLASMA GENERATION AND TRANSPORT -- Low-Pressure Plasma Modeling -- Analysis -- Fluid Simulations -- Particle-In-Cell and Kinetic Simulations -- Thermal Plasma Modeling -- Toward Cad Tools And Expert Systems -- Chemical Kinetics -- Multidimensional Modeling and Magnetic Effects -- Stability of Processing Plasmas -- Accuracy and Reliability of Numerical Simulation Methods -- Plasma Diagnostics -- Positive Ions and Neutrals -- Electron Density and Energy Distribution -- Fields -- Negative Ions -- Particulates -- Reference Reactors -- Data Base for Plasma Generation and Transport -- Present Status. 327 $aNeeds -- Distribution of Information -- PLASMA-SURFACE INTERACTIONS -- Boundary Conditions -- Passive Surfaces -- Particulates -- Microstructure Evolution -- In Situ Analysis -- FUNDING FOR PLASMA PROCESSING RESEARCH -- Japanese Research -- French Research -- FINDINGS AND CONCLUSIONS -- 5 Educational Issues -- EDUCATIONAL REQUIREMENTS FOR UNDERGRADUATES -- Laboratory Courses and the Scientific Method -- Research Experiences and Cooperative Programs -- U.S. GRADUATE EDUCATION -- TEXTS AND COMPUTER-AIDED INSTRUCTION -- FACULTY DEVELOPMENT -- CONTINUING EDUCATION -- FOREIGN EDUCATIONAL OFFERINGS -- Japan -- France -- FINDINGS AND CONCLUSIONS -- Appendix Participants in Workshop on Plasma Processing of Materials. 606 $aPlasma engineering 606 $aMicroelectronics$xMaterials$xEffect of radiation on 606 $aSurfaces (Technology) 615 0$aPlasma engineering. 615 0$aMicroelectronics$xMaterials$xEffect of radiation on. 615 0$aSurfaces (Technology) 676 $a621.044 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910817008203321 996 $aPlasma processing of materials$93973929 997 $aUNINA