LEADER 07065nam 2201129 450 001 9910814493303321 005 20230730073716.0 010 $a1-63853-161-7 010 $a1-62623-261-X 024 7 $a10.1055/b-004-135647 035 $a(CKB)4340000000249062 035 $a(MiAaPQ)EBC5314666 035 $a10.1055-b-004-135647 035 $a(DE-2912)1530202639353 035 $a(EXLCZ)994340000000249062 100 $a20180322h20182018 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $2rdacontent 182 $2rdamedia 183 $2rdacarrier 200 10$aNeuromuscular Spine Deformity /$fby: Samdani, Amer F., Newton, Peter O., Sponseller, Paul D., Shufflebarger, Harry L., Betz, Randal R. 210 1$aNew York, New York :$cThieme,$d2018. 210 4$dİ2018 215 $a1 online resource (186 pages) $cillustrations (some color), photographs 300 $a"264 Illustrations." 311 $a1-62623-260-1 320 $aIncludes bibliographical references at the end of each chapters and index. 330 $a"About 85% of spine deformities (scoliosis, kyphosis, lordosis) are idiopathic, but some forms are caused by severe neuromuscular disorder such as muscular dystrophy, cerebral palsy, Friedreich's ataxia, and spinal cord tumors and lesions. These are more difficult conditions, since curve progression is much greater than in idiopathic conditions and bracing does not usually prevent progression of the spinal curvature. Smaller curvatures in nonambulatory patients can sometimes be treated by wheelchair modifications, but most patients will undergo surgery. These surgeries are complex because of the severity of the condition itself and because of the various other medical conditions affecting these patients. There is currently no book on the topic, and chapters in spine deformity books give the topic scant coverage. Samdani et al are the world's leader in this field, and they will present the definitive book on the topic, featuring foundational chapters, coverage of the specific neuromuscular disorders, surgical techniques, and postop considerations and complications, and the will be accompanied by surgical videos. The Authors are members of the prestigious Harms Study Group, a worldwide association of spine surgeons performing multi-center research studies on scoliosis"--Provided by publisher. 606 $aSpine$xAbnormalities$xSurgery 606 $aNeuromuscular diseases$xComplications 606 $aSpinal Curvatures$xsurgery 606 $aNeuromuscular Diseases$xcomplications 606 $aOrthopedic Procedures$xmethods 606 $aPerioperative Care 606 $aChild 615 0$aSpine$xAbnormalities$xSurgery. 615 0$aNeuromuscular diseases$xComplications. 615 12$aSpinal Curvatures$xsurgery. 615 22$aNeuromuscular Diseases$xcomplications. 615 22$aOrthopedic Procedures$xmethods. 615 22$aPerioperative Care. 615 22$aChild. 676 $a617.56059 700 $aAbel$b Mark F$4aut$4http://id.loc.gov/vocabulary/relators/aut$01618074 702 $aSamdani$b Amer F$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aNewton$b Peter O$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aSponseller$b Paul D$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aShufflebarger$b Harry L$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aBetz$b Randal R$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aAlman$b Benjamin$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aAsghar$b Jahangir K$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aBachmann$b Keith R$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aCahill$b Patrick J$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aCruz$b Dana L$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aDabney$b Kirk W$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aErrico$b Thomas J$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aFuller$b Corey B$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aGabos$b Peter G$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aGorenc$b Kathleen$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aGupta$b Munish$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aHoffman$b Eve$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aHwang$b Steven W$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aKelly$b Michael P$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aKhanna$b Sandeep$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aKiely$b Paul D$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aLafage$b Virginie$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aLawing$b Cheryl R$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aLehman Jr$b Ronald A$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aLenke$b Lawrence G$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aLuhmann$b Scott J$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aMilby$b Andrew H$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aMitchell$b Stuart L$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aMiyanji$b Firoz$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aMurphy$b Joshua S$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aNarayanan$b Unni G$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aPahys$b Joshua M$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aParent$b Stefan$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aProtopsaltis$b Themistocles$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aRoguski$b Marie$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aRoye$b Benjamin D$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aScannell$b Brian P$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aShah$b Suken A$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aShasti$b Mark$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aSingla$b Anuj$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aStephen$b James H$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aTawari$b Akhil$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aUpasani$b Vidyadhar V$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aVira$b Shaleen$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aVitale$b Michael G$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aWagner$b Scott C$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aYaszay$b Burt$4aut$4http://id.loc.gov/vocabulary/relators/aut 801 0$bDE-2912 906 $aBOOK 912 $a9910814493303321 996 $aNeuromuscular Spine Deformity$93949586 997 $aUNINA LEADER 03924nam 22005055 450 001 9910254242703321 005 20251113211131.0 010 $a3-319-20481-5 024 7 $a10.1007/978-3-319-20481-9 035 $a(CKB)3710000000667101 035 $a(DE-He213)978-3-319-20481-9 035 $a(MiAaPQ)EBC4526846 035 $a(PPN)194078426 035 $a(EXLCZ)993710000000667101 100 $a20160511d2016 u| 0 101 0 $aeng 135 $aurnn|008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$a3D Stacked Chips $eFrom Emerging Processes to Heterogeneous Systems /$fedited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis 205 $a1st ed. 2016. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2016. 215 $a1 online resource (XXIII, 339 p. 238 illus., 157 illus. in color.) 311 08$a3-319-20480-7 320 $aIncludes bibliographical references at the end of each chapters and index. 327 $aIntroduction to Electrical 3D Integration -- Copper-based TSV ? Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-. 330 $aThis book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.   ?Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; ?Explains the use of wireless 3D integration to improve 3D IC reliability and yield; ?Describes techniques for monitoring and mitigating thermal behavior in 3D ICs; ?Includes discussion of 3D integration of high-density power sources and novel NVM. 606 $aElectronic circuits 606 $aMicroprocessors 606 $aComputer architecture 606 $aElectronic Circuits and Systems 606 $aProcessor Architectures 615 0$aElectronic circuits. 615 0$aMicroprocessors. 615 0$aComputer architecture. 615 14$aElectronic Circuits and Systems. 615 24$aProcessor Architectures. 676 $a621.3815 702 $aElfadel$b Ibrahim (Abe) M$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aFettweis$b Gerhard$4edt$4http://id.loc.gov/vocabulary/relators/edt 906 $aBOOK 912 $a9910254242703321 996 $a3D Stacked Chips$91539937 997 $aUNINA