LEADER 05874nam 2200745Ia 450 001 9910814322803321 005 20200520144314.0 010 $a9781119990093 010 $a1-119-99000-9 010 $a1-283-40520-2 010 $a9786613405203 010 $a1-119-99010-6 010 $a1-119-99009-2 035 $a(CKB)3460000000003357 035 $a(EBL)675196 035 $a(OCoLC)742333202 035 $a(SSID)ssj0000476989 035 $a(PQKBManifestationID)11320079 035 $a(PQKBTitleCode)TC0000476989 035 $a(PQKBWorkID)10501676 035 $a(PQKB)10184062 035 $a(MiAaPQ)EBC675196 035 $a(Au-PeEL)EBL675196 035 $a(CaPaEBR)ebr10510634 035 $a(CaONFJC)MIL340520 035 $a(EXLCZ)993460000000003357 100 $a20101207d2011 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aFailure analysis $ea practical guide for manufacturers of electronic components and systems /$fMarius I. Bazu, Titu-Marius I. Bajenescu 210 $aChichester, West Sussex, U.K. $cWiley$dc2011 215 $a1 online resource (341 pages) 225 1 $aWiley series in quality & reliability engineering 300 $aDescription based upon print version of record. 311 1 $a9780470748244 311 1 $a0-470-74824-9 320 $aIncludes bibliographical references and index. 327 $aFAILURE ANALYSIS; Contents; Series Editor's Foreword; Foreword by Dr Craig Hillman; Series Editor's Preface; Preface; About the Authors; 1 Introduction; 1.1 The Three Goals of the Book; 1.2 Historical Perspective; 1.2.1 Reliability Prehistory; 1.2.2 The Birth of Reliability as a Discipline; 1.2.3 Historical Development of Reliability; 1.2.4 Tools for Failure Analysis; 1.3 Terminology; 1.4 State of the Art and Future Trends; 1.4.1 Techniques of Failure Analysis; 1.4.2 Failure Mechanisms; 1.4.3 Models for the Physics-of-Failure; 1.4.4 Future Trends; 1.5 General Plan of the Book; References 327 $a2 Failure Analysis - Why?2.1 Eight Possible Applications; 2.2 Forensic Engineering; 2.2.1 FA at System Level; 2.2.2 FA at Component Level; 2.3 Reliability Modelling; 2.3.1 Economic Benefits of Using Reliability Models; 2.3.2 Reliability of Humans; 2.4 Reverse Engineering; 2.5 Controlling Critical Input Variables; 2.6 Design for Reliability; 2.7 Process Improvement; 2.7.1 Reliability Assurance; 2.8 Saving Money through Early Control; 2.9 A Synergetic Approach; 2.9.1 Synergies of Technological Factors; 2.9.2 Test Structures; 2.9.3 Packaging Reliability 327 $a2.9.4 Synergies of Operational Stress Factors2.9.5 Synergetic Team; References; 3 Failure Analysis - When?; 3.1 Failure Analysis during the Development Cycle; 3.1.1 Concurrent Engineering; 3.1.2 Failure Analysis during the Design Stage; 3.1.3 Virtual Prototyping; 3.1.4 Reliability Testing during the Development Cycle; 3.2 Failure Analysis during Fabrication Preparation; 3.2.1 Reliability Analysis of Materials; 3.2.2 Degradation Phenomena in Polymers used in Electron Components; 3.3 FA during Fabrication; 3.3.1 Manufacturing History; 3.3.2 Reliability Monitoring; 3.3.3 Wafer-Level Reliability 327 $a3.3.4 Yield and Reliability3.3.5 Packaging Reliability; 3.3.6 Improving Batch Reliability: Screening and Burn-In; 3.4 FA after Fabrication; 3.4.1 Standard-Based Testing; 3.4.2 Knowledge-Based Testing; 3.5 FA during Operation; 3.5.1 Failure Types during Operation; 3.5.2 Preventive Maintenance of Electronic Systems; References; 4 Failure Analysis - How?; 4.1 Procedures for Failure Analysis; 4.2 Techniques for Decapsulating the Device and for Sample Preparation; 4.2.1 Decapping Techniques; 4.2.2 Decapsulation Techniques; 4.2.3 Cross-Sectioning; 4.2.4 Focused Ion Beam; 4.2.5 Other Techniques 327 $a4.3 Techniques for Failure Analysis4.3.1 Electrical Techniques; 4.3.2 Optical Microscopy; 4.3.3 Scanning Probe Microscopy (SPM); 4.3.4 Microthermographical Techniques; 4.3.5 Electron Microscopy; 4.3.6 X-Ray Techniques; 4.3.7 Spectroscopic Techniques; 4.3.8 Acoustic Techniques; 4.3.9 Laser Techniques; 4.3.10 Holographic Interferometry; 4.3.11 Emission Microscopy; 4.3.12 Atom Probe; 4.3.13 Neutron Radiography; 4.3.14 Electromagnetic Field Measurements; 4.3.15 Other Techniques; References; 5 Failure Analysis - What?; 5.1 Failure Modes and Mechanisms at Various Process Steps; 5.1.1 Wafer Level 327 $a5.1.2 Packaging 330 $aFailure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers nee 410 0$aWiley series in quality and reliability engineering. 606 $aElectronic apparatus and appliances$xReliability 606 $aElectronic systems$xTesting 606 $aSystem failures (Engineering)$xPrevention 615 0$aElectronic apparatus and appliances$xReliability. 615 0$aElectronic systems$xTesting. 615 0$aSystem failures (Engineering)$xPrevention. 676 $a621.381 686 $aTEC032000$2bisacsh 700 $aBazu$b M. I$g(Marius I.),$f1948-$01615327 701 $aBajenescu$b Titu I.$f1938-$0479747 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910814322803321 996 $aFailure analysis$94196434 997 $aUNINA