LEADER 04506nam 2200613 450 001 9910811577503321 005 20230803205450.0 010 $a3-03826-636-1 035 $a(CKB)3710000000251918 035 $a(EBL)1910949 035 $a(SSID)ssj0001378389 035 $a(PQKBManifestationID)11801049 035 $a(PQKBTitleCode)TC0001378389 035 $a(PQKBWorkID)11339245 035 $a(PQKB)10166864 035 $a(Au-PeEL)EBL1910949 035 $a(CaPaEBR)ebr10951273 035 $a(OCoLC)893677821 035 $a(MiAaPQ)EBC1910949 035 $a(EXLCZ)993710000000251918 100 $a20141017h20142014 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$a11th international congress molded interconnect devices $escientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /$fedited by Jo?rg Franke [and three others] 210 1$aPfaffikon, Switzerland :$cTTP,$d2014. 210 2$aEnfield, New Hampshire :$cTrans Tech Publications Ltd,$d[date of distribution not identified] 210 4$dİ2014 215 $a1 online resource (119 p.) 225 1 $aAdvanced Materials Research,$x1662-8985 ;$vVolume 1038 300 $aDescription based upon print version of record. 311 $a3-03835-252-7 320 $aIncludes bibliographical references at the end of each chapters and index. 327 $a11th International Congress Molded Interconnect Devices - Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts 327 $aChapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz 327 $aNovel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection 327 $aDesign and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index 330 $aCollection of selected, peer reviewed papers from the 11 th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. 410 0$aAdvanced materials research ;$vVolume 1038. 606 $aMolded interconnect devices 606 $aThree-dimensional display systems$vCongresses 615 0$aMolded interconnect devices. 615 0$aThree-dimensional display systems 676 $a621.367 702 $aFranke$b Jo?rg 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910811577503321 996 $a11th international congress molded interconnect devices$93971762 997 $aUNINA