LEADER 00850nam0-22003011i-450 001 990004173480403321 005 20211112163951.0 035 $a000417348 100 $a19990604d1964----km-y0itay50------ba 101 0 $aeng 102 $aGB 105 $af---c---001cy 200 1 $aRuskin today$fchosen and annotated by Kenneth Clark 210 $aLondon$cYohn Murray$d1964 215 $aXXI, 362 p., [9] c. di tav.$d23 cm 610 0 $aRuskin, John$aScritti$aAntologie 676 $a701$v22$zita 700 1$aRuskin,$bJohn$f<1819-1900>$011255 702 1$aClark,$bKenneth$f<1903-1983> 801 0$aIT$bUNINA$gRICA$2UNIMARC 901 $aBK 912 $a990004173480403321 952 $aP.3 BR.C.254$bBibl.32522$fFLFBC 952 $a07.114$b5244$fDARST 959 $aFLFBC 959 $aDARST 996 $aRuskin today$9485885 997 $aUNINA LEADER 05140nam 2200757Ia 450 001 9910808640503321 005 20200520144314.0 010 $a9786613282668 010 $a9781283282666 010 $a1283282666 010 $a9781118056769 010 $a1118056760 010 $a9781118056776 010 $a1118056779 010 $a9781118056752 010 $a1118056752 035 $a(CKB)2550000000054327 035 $a(EBL)697484 035 $a(SSID)ssj0000534886 035 $a(PQKBManifestationID)11332198 035 $a(PQKBTitleCode)TC0000534886 035 $a(PQKBWorkID)10518241 035 $a(PQKB)11194377 035 $a(Au-PeEL)EBL697484 035 $a(CaPaEBR)ebr10501333 035 $a(CaONFJC)MIL328266 035 $a(OCoLC)761319804 035 $a(MiAaPQ)EBC697484 035 $a(Perlego)1011014 035 $a(EXLCZ)992550000000054327 100 $a20110106d2011 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aCeramic integration and joining technologies $efrom macro to nanoscale /$fedited by Mrityunjay Singh ... [et al.] 205 $a1st ed. 210 $aHoboken, N.J. $cWiley-American Ceramic Society$d2011 215 $a1 online resource (832 p.) 300 $aDescription based upon print version of record. 311 08$a9780470391228 311 08$a0470391227 320 $aIncludes bibliographical references and index. 327 $aCERAMIC INTEGRATION AND JOINING TECHNOLOGIES: From Macro to Nanoscale; CONTENTS; PREFACE; CONTRIBUTORS; PART I: INTRODUCTION; 1: CERAMIC INTEGRATION ACROSS LENGTH SCALES: TECHNICAL ISSUES, CHALLENGES, AND OPPORTUNITIES; PART II: SCIENCE AND TECHNOLOGY FOR MACROSCALE INTEGRATION; 2: CERAMIC COMPONENT INTEGRATION BY ADVANCED BRAZING TECHNOLOGIES; 3: JOINING AND INTEGRATION ISSUES OF CERAMIC MATRIX COMPOSITES FOR THE NUCLEAR INDUSTRY; 4: AIR BRAZING: A NEW METHOD OF CERAMIC-CERAMIC AND CERAMIC-METAL JOINING 327 $a5: DIFFUSION BONDING OF SILICON CARBIDE AS AN ENABLING TECHNOLOGY FOR THE FABRICATION OF COMPLEX-SHAPED CERAMIC COMPONENTS6: INTEGRATION OF CARBON-CARBON COMPOSITE TO METALLIC SYSTEMS FOR THERMAL MANAGEMENT APPLICATIONS; 7: CONTACT INTERACTION IN CARBON-METAL SYSTEMS FOR JOINING AND INTEGRATION; PART III: INTEGRATION ISSUES IN ENERGY GENERATION AND DEVICE FABRICATION; 8: INTEGRATION TECHNOLOGIES FOR FERRITES AND POWER INDUCTORS IN CERAMIC CIRCUIT BOARDS; 9: OXIDE THERMOELECTRIC POWER GENERATION; 10: INTEGRATION TECHNOLOGIES FOR SOLID OXIDE FUEL CELLS (SOFCS) AND OTHER ELECTROCHEMICAL REACTORS 327 $a11: INTEGRATION TECHNOLOGIES FOR SENSORS12: ON-CHIP INTEGRATION OF FUNCTIONAL HYBRID MATERIALS AND COMPONENTS IN NANOPHOTONICS AND OPTOELECTRONICS; 13: INTEGRATION OF MULTIFUNCTIONAL PROPERTIES IN THERMAL BARRIER COATINGS BY CHEMICAL VAPOR DEPOSITION; 14: THE CHANGING PHYSICS IN METAL INTERCONNECT RELIABILITY; 15: INTEGRATION ISSUES OF BARIUM STRONTIUM TITANA TETHIN FILM FOR TUNABLE MICROWAVE APPLICATIONS; 16: AEROSOL DEPOSITION (AD) INTEGRATION TECHNIQUES AND THEIR APPLICATION TO MICRODEVICES; PART IV: NANO- AND BIOINTEGRATION 327 $a17: ADVANCES IN NANOINTEGRATION METHODOLOGIES: PATTERNING, POSITIONING, AND SELF-ASSEMBLY18: INTEGRATION OF NANOWIRES IN NEW DEVICES AND CIRCUIT ARCHITECTURES: RECENT DEVELOPMENTS AND CHALLENGES; 19: INTEGRATING DIAMOND LIKE CARBON INTO NANOSTRUCTURE DESIGNS (FABRICATING MICROSCALE AND NANOSCALE ARCHITECTURES OF DIAMOND-LIKE CARBON FILMS); 20: SYNTHESIS, PROPERTIES, INTEGRATION, AND APPLICATIONS OF VERTICALLY ALIGNED CERAMIC NANOSTRUCTURES; 21: NANOINTEGRATION BASED ON THIN-FILM TECHNOLOGY; 22: MASS-MANUFACTURABLE NANOWIRE INTEGRATION: CHALLENGES AND RECENT DEVELOPMENTS 327 $a23: USABILITY OF INK-JET PRINTING TECHNOLOGY AND NANOMATERIALS IN ELECTRICAL INTERCONNECTIONS, ELECTRONIC PACKAGING, AND SYSTEM INTEGRATION FOR MICROELECTRONICS APPLICATIONS24: BIOINTEGRATION OF PROSTHETIC DEVICES; INDEX 330 $aThis book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, sol 606 $aCeramic materials 606 $aManufacturing processes 606 $aJoints (Engineering) 615 0$aCeramic materials. 615 0$aManufacturing processes. 615 0$aJoints (Engineering) 676 $a620.1/4 686 $aTEC021000$2bisacsh 701 $aSingh$b M$g(Mrityunjay)$013684 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910808640503321 996 $aCeramic integration and joining technologies$94022689 997 $aUNINA