LEADER 02442nam 2200613 450 001 9910797634103321 005 20230808212335.0 010 $a1-4985-0562-7 035 $a(CKB)3710000000486401 035 $a(EBL)4086454 035 $a(SSID)ssj0001555582 035 $a(PQKBManifestationID)16181796 035 $a(PQKBTitleCode)TC0001555582 035 $a(PQKBWorkID)14010852 035 $a(PQKB)11174630 035 $a(MiAaPQ)EBC4086454 035 $a(EXLCZ)993710000000486401 100 $a20150814h20162016 uy| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aLesbian, queer, and bisexual women in heterosexual relationships $enarratives of sexual identity /$fAhoo Tabatabai 210 1$aLanham [Maryland] :$cLexington Books,$d[2016] 210 4$d©2016 215 $a1 online resource (113 p.) 300 $aDescription based upon print version of record. 311 $a1-4985-0563-5 311 $a1-4985-0561-9 320 $aIncludes bibliographical references and index. 327 $aIntroduction: the individual and her stories -- Narratives -- Appearance -- Not bisexual -- Not lesbian -- Not straight -- Hetero-cash -- Conclusion. 330 $aUsing narrative analysis, this book draws on interviews with women who left relationships with other women to begin relationships with men in order to understand how these women make sense of their sexual identities. It gives a voice to feminist, queer women who find themselves viewed by society as heterosexual but who themselves, with two exceptions, do not identify as such. 606 $aLesbians$xIdentity 606 $aLesbians$xRelations with heterosexuals 606 $aLesbians$xSexual behavior 606 $aBisexual women$xIdentity 606 $aBisexual women$xSexual behavior 606 $aHeterosexuality 615 0$aLesbians$xIdentity. 615 0$aLesbians$xRelations with heterosexuals. 615 0$aLesbians$xSexual behavior. 615 0$aBisexual women$xIdentity. 615 0$aBisexual women$xSexual behavior. 615 0$aHeterosexuality. 676 $a306.76/63 700 $aTabatabai$b Ahoo$f1978-$01558906 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910797634103321 996 $aLesbian, queer, and bisexual women in heterosexual relationships$93823734 997 $aUNINA LEADER 03873nam 22007455 450 001 9910298608203321 005 20250609110127.0 010 $a3-319-18675-2 024 7 $a10.1007/978-3-319-18675-7 035 $a(CKB)3710000000532480 035 $a(EBL)4544090 035 $a(SSID)ssj0001597008 035 $a(PQKBManifestationID)16297905 035 $a(PQKBTitleCode)TC0001597008 035 $a(PQKBWorkID)14885903 035 $a(PQKB)11363829 035 $a(DE-He213)978-3-319-18675-7 035 $a(MiAaPQ)EBC4544090 035 $z(PPN)258869860 035 $a(PPN)190879998 035 $a(MiAaPQ)EBC6231789 035 $a(EXLCZ)993710000000532480 100 $a20151209d2015 u| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aThree-Dimensional Integration of Semiconductors $eProcessing, Materials, and Applications /$fedited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi 205 $a1st ed. 2015. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2015. 215 $a1 online resource (423 p.) 300 $aDescription based upon print version of record. 311 08$a3-319-18674-4 320 $aIncludes bibliographical references at the end of each chapters and index. 327 $aResearch and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET. 330 $aThis book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects. 606 $aElectrochemistry 606 $aElectrical engineering 606 $aSemiconductors 606 $aMechanical engineering 606 $aBiomedical engineering 606 $aElectrochemistry$3https://scigraph.springernature.com/ontologies/product-market-codes/C21010 606 $aElectrical Engineering$3https://scigraph.springernature.com/ontologies/product-market-codes/T24000 606 $aSemiconductors$3https://scigraph.springernature.com/ontologies/product-market-codes/P25150 606 $aMechanical Engineering$3https://scigraph.springernature.com/ontologies/product-market-codes/T17004 606 $aBiomedical Engineering and Bioengineering$3https://scigraph.springernature.com/ontologies/product-market-codes/T2700X 615 0$aElectrochemistry. 615 0$aElectrical engineering. 615 0$aSemiconductors. 615 0$aMechanical engineering. 615 0$aBiomedical engineering. 615 14$aElectrochemistry. 615 24$aElectrical Engineering. 615 24$aSemiconductors. 615 24$aMechanical Engineering. 615 24$aBiomedical Engineering and Bioengineering. 676 $a621.38152 702 $aKondo$b Kazuo$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aKada$b Morihiro$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aTakahashi$b Kenji$4edt$4http://id.loc.gov/vocabulary/relators/edt 906 $aBOOK 912 $a9910298608203321 996 $aThree-Dimensional Integration of Semiconductors$92276625 997 $aUNINA