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035   $a(MiAaPQ)EBC5019054
035   $a(OCoLC)1003262196
035   $a(EXLCZ)994340000000197035
100   $a20170927h20162016  uy             0
101 0 $aeng
135   $aurcnu||||||||
181   $2rdacontent
182   $2rdamedia
183   $2rdacarrier
200 10$aDevelopment of sub-mm wave flip-chip interconnect /$fSirinpa Monayakul
205   $a1st edition.
210  1$aGottingen, Germany :$cCuvillier Verlag,$d2016.
210  4$dİ2016
215   $a1 online resource (142 pages) $cillustrations (some color)
225 0 $aInnovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut fur Hochstfrequenztechnik ;$vBand 38
311 1 $a3-7369-9410-9 
320   $aIncludes bibliographical references.
606   $aGold alloys
606   $aEutectic alloys
606   $aFlip chip technology
615  0$aGold alloys.
615  0$aEutectic alloys.
615  0$aFlip chip technology.
676   $a600
700   $aMonayakul$b Sirinpa$01502657
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910794717203321
996   $aDevelopment of sub-mm wave flip-chip interconnect$93730521
997   $aUNINA