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010   $a9786613684493
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100   $a20100514d2012||||  uy|            0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 00$aLCP for microwave packages and modules /$f[edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara$b[electronic resource]
210  1$aCambridge :$cCambridge University Press,$d2012.
215   $a1 online resource (xiv, 253 pages) $cdigital, PDF file(s)
225 1 $aThe Cambridge RF and microwave engineering series
300   $aTitle from publisher's bibliographic system (viewed on 05 Oct 2015).
311   $a1-107-00378-4 
320   $aIncludes bibliographical references and index.
327   $aMachine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability.
330   $aA comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.
410  0$aCambridge RF and microwave engineering series.
517 3 $aLCP for Microwave Packages & Modules
606   $aMicrowave devices$xMaterials
606   $aFlexible electronics
606   $aMicroelectronic packaging$xMaterials
606   $aLiquid crystal devices
606   $aPolymer liquid crystals
615  0$aMicrowave devices$xMaterials.
615  0$aFlexible electronics.
615  0$aMicroelectronic packaging$xMaterials.
615  0$aLiquid crystal devices.
615  0$aPolymer liquid crystals.
676   $a621.381/3
686   $aTEC024000$2bisacsh
702   $aPham$b Anh-Vu H.
702   $aChen$b Morgan J.
702   $aAihara$b Kunia
801  0$bUkCbUP
801  1$bUkCbUP
906   $aBOOK
912   $a9910790345703321
996   $aLCP for microwave packages and modules$93695537
997   $aUNINA