LEADER 03612oam 2200697I 450 001 9910784856803321 005 20230422045011.0 010 $a0-429-20814-6 010 $a0-585-41708-3 010 $a9786610208937 010 $a1-135-55379-3 010 $a0-203-90847-3 010 $a1-280-20893-7 024 7 $a10.1201/9780203908471 035 $a(CKB)1000000000403657 035 $a(EBL)216010 035 $a(OCoLC)559647226 035 $a(SSID)ssj0000200067 035 $a(PQKBManifestationID)11178975 035 $a(PQKBTitleCode)TC0000200067 035 $a(PQKBWorkID)10196656 035 $a(PQKB)10049204 035 $a(MiAaPQ)EBC216010 035 $a(Au-PeEL)EBL216010 035 $a(CaPaEBR)ebr10051222 035 $a(CaONFJC)MIL20893 035 $a(OCoLC)1226773520 035 $a(FINmELB)ELB141652 035 $a(EXLCZ)991000000000403657 100 $a20180331d2000 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aMechanical properties of ceramics and composites $egrain and particle effects /$fRoy W. Rice 210 1$aNew York :$cMarcel Dekker,$d2000. 215 $a1 online resource (709 p.) 225 1 $aMaterials engineering 300 $aDescription based upon print version of record. 311 $a0-8247-8874-5 311 $a0-8247-4528-0 327 $aPreface; Contents; Symbols and Abbreviations; Introduction to Grain and Particle Effects on Ceramic and Ceramic Composite Properties; Grain Dependence of Microcracking, Crack Propagation, and Fracture Toughness at ~ 22°C; Grain Dependence of Ceramic Tensile Strengths at ~ 22°C; Grain Dependence of Indentation Hardness at ~ 22°C; Grain Dependence of Compressive Strength, Wear, and Related Behavior at ~ 22°C; Grain Effects on Thermal Shock Resistance and Elevated Temperature Crack Propagation, Toughness, and Tensile Strength 327 $aGrain Dependence of Hardness, Compressive Strength, Wear, and Related Behavior at Elevated TemperaturesParticle (and Grain) Effects on Elastic Properties, Crack Propagation, and Fracture Toughness of Ceramic Composites at ~ 22°C; Particle Dependence of Tensile Strength of Ceramic Composites at ~ 22°C; Composite Particle and Grain Effects on Hardness, Compressive Strength, Wear, and Related Behavior at ~ 22°C; Particle and Grain Effects on Mechanical Properties of Composites at Elevated Temperature 327 $aSummary and Perspective for the Microstructural Dependence of Mechanical Properties of Dense Monolithic and Composite CeramicsIndex 330 $aA comprehensive review, evaluation and summary of the dependence of mechanical properties on grain and particle parameters of monolithic ceramics and ceramic composites, addressing size, shape and orientation. It emphasizes the critical link between fabrication and ceramic performance. 410 0$aMaterials engineering (Marcel Dekker, Inc.) ;$v17. 606 $aCeramic materials$xMechanical properties 606 $aComposite materials$xMechanical properties 606 $aCeramic-matrix composites$xMechanical properties 615 0$aCeramic materials$xMechanical properties. 615 0$aComposite materials$xMechanical properties. 615 0$aCeramic-matrix composites$xMechanical properties. 676 $a620.1/404292 700 $aRice$b R. W$g(Roy Warren),$f1934,$01562771 801 0$bFlBoTFG 801 1$bFlBoTFG 906 $aBOOK 912 $a9910784856803321 996 $aMechanical properties of ceramics and composites$93830661 997 $aUNINA LEADER 01819nas 2200577-a 450 001 996200085003316 005 20230217213020.0 011 $a1572-8137 035 $a(OCoLC)51062353 035 $a(CKB)111027698973012 035 $a(CONSER)--2004255476 035 $a(DE-599)ZDB2065612-9 035 $a(EXLCZ)99111027698973012 100 $a20021125a20029999 s-- a 101 0 $aeng 135 $aurmnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 00$aJournal of computational electronics 210 $a[Dordrecht, the Netherlands] $cKluwer Academic Publishers$d2002- 210 3 $a[New York] $cSpringer US 300 $aRefereed/Peer-reviewed 300 $aTitle from journal home page (Kluwer, viewed Nov. 22, 2002). 311 $a1569-8025 517 3 $aComputational electronics 531 $aJ COMPUT ELECTRON 531 $aJ. COMPUT. ELECTRON 606 $aElectrical engineering$vPeriodicals 606 $aPhysics$vPeriodicals 606 $aMathematics$vPeriodicals 606 $aComputer science$vPeriodicals 606 $aComputer science$2fast$3(OCoLC)fst00872451 606 $aElectrical engineering$2fast$3(OCoLC)fst01728596 606 $aMathematics$2fast$3(OCoLC)fst01012163 606 $aPhysics$2fast$3(OCoLC)fst01063025 608 $aPeriodicals.$2fast 608 $aPeriodicals.$2lcgft 610 $aElectrical Engineering 615 0$aElectrical engineering 615 0$aPhysics 615 0$aMathematics 615 0$aComputer science 615 7$aComputer science. 615 7$aElectrical engineering. 615 7$aMathematics. 615 7$aPhysics. 906 $aJOURNAL 912 $a996200085003316 996 $aJournal of computational electronics$91921220 997 $aUNISA