LEADER 01609nam 2200529 450 001 9910397886903321 005 20211005180259.0 010 $a84-9148-836-7 035 $a(CKB)4100000006998292 035 $a(MiAaPQ)EBC5634715 035 $a(MiAaPQ)EBC6514357 035 $a(Au-PeEL)EBL6514357 035 $a(OCoLC)1056198946 035 $a(EXLCZ)994100000006998292 100 $a20190124d2018 uy 0 101 0 $aspa 135 $aurcnu|||||||| 181 $ctxt$2rdacontent/spa 182 $cc$cc$2rdamedia/spa 183 $acr$2rdacarrier/spa 200 03$aEl convenio de Estambul como marco de derecho antisubordiscriminatorio /$fJuana Gil Rui?z, editora 210 1$aMadrid :$cDykinson,$d2018. 215 $a1 recurso en li?nea (398 pa?ginas) 300 $aContiene i?ndice. 311 $a84-9148-795-6 320 $aContiene bibliografi?a. 606 $aViolencia de ge?nero 606 $aDerechos humanos 606 $aDerecho internacional 606 $aWomen$xViolence against 606 $aHuman rights 606 $aInternational law 608 $aLibros electronicos. 615 4$aViolencia de ge?nero. 615 4$aDerechos humanos. 615 4$aDerecho internacional. 615 0$aWomen$xViolence against. 615 0$aHuman rights. 615 0$aInternational law. 676 $a362.88082 702 $aGil Rui?z$b Juana 801 0$bFINmELB 801 1$bFINmELB 906 $aBOOK 912 $a9910397886903321 996 $aEl convenio de Estambul como marco de derecho antisubordiscriminatorio$91900256 997 $aUNINA LEADER 03288nam 2200649Ia 450 001 9910450562603321 005 20200520144314.0 010 $a1-281-36874-1 010 $a9786611368746 010 $a1-4039-8058-6 024 7 $a10.1057/9781403980588 035 $a(CKB)1000000000342691 035 $a(EBL)307750 035 $a(OCoLC)560468890 035 $a(SSID)ssj0000140332 035 $a(PQKBManifestationID)11132466 035 $a(PQKBTitleCode)TC0000140332 035 $a(PQKBWorkID)10053267 035 $a(PQKB)10215658 035 $a(DE-He213)978-1-4039-8058-8 035 $a(MiAaPQ)EBC307750 035 $a(Au-PeEL)EBL307750 035 $a(CaPaEBR)ebr10135667 035 $a(CaONFJC)MIL136874 035 $a(EXLCZ)991000000000342691 100 $a20050209d2005 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aDivine play, sacred laughter, and spiritual understanding$b[electronic resource] /$fby Patrick Laude 205 $a1st ed. 210 $aNew York $cPalgrave Macmillan$d2005 215 $a1 online resource (280 p.) 300 $aDescription based upon print version of record. 311 $a1-349-53173-1 311 $a1-4039-7015-7 320 $aIncludes bibliographical references (p. [263]-270) and index. 327 $aCover; Table of Contents; Acknowledgments; Introduction; 1 Ma?ya? and the Divine Treasure; 2 Ambiguity of the Demiurge; 3 Dionysus, Shiva, Osiris; 4 Divine Troublemakers; 5 Coyote and Kin; 6 Reading the Trickster's Footsteps; 7 Thundering Clowns; 8 Spiritual Laughter; 9 Fools for Christ's Sake; 10 The People of Blame; 11 Fools on a Tightrope; 12 Epilogue: Cracks of Light; Notes; Bibliography; Index 330 $aThis study in the relationship between religion and the comic focuses on the ways in which the latter fulfils a central function in the sacred understanding of reality of pre-modern cultures and the spiritual life of religious traditions. The central thesis is that figures such as tricksters, sacred clowns, and holy fools play an essential role in bridging the gap between the divine and the human by integrating the element of disequilibrium that results from the contact between incommensurable realities. This interdisciplinary and cross-cultural series of essays is devoted to spiritual, anthropological, and literary characters and phenomena that point to a deeper understanding of the various mythological, ceremonial, and mystical ways in which the fundamental ambiguity of existence is symbolized and acted out. Given its interdisciplinary and cross-cultural perspective, this volume will appeal to scholars from a variety of fields. 606 $aLaughter$xReligious aspects 606 $aWit and humor$xReligious aspects 606 $aReligion$vHumor 608 $aElectronic books. 615 0$aLaughter$xReligious aspects. 615 0$aWit and humor$xReligious aspects. 615 0$aReligion 676 $a202/.1 700 $aLaude$b Patrick$f1958-$0971176 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910450562603321 996 $aDivine play, sacred laughter, and spiritual understanding$92207678 997 $aUNINA LEADER 05469nam 2200661 n 450 001 9910784359603321 005 20230120004325.0 010 $a1-281-00979-2 010 $a9786611009793 010 $a0-08-047709-7 035 $a(CKB)1000000000349961 035 $a(EBL)234967 035 $a(OCoLC)213331960 035 $a(SSID)ssj0000136751 035 $a(PQKBManifestationID)11144300 035 $a(PQKBTitleCode)TC0000136751 035 $a(PQKBWorkID)10084014 035 $a(PQKB)11292172 035 $a(MiAaPQ)EBC234967 035 $a(Au-PeEL)EBL234967 035 $a(CaPaEBR)ebr10127899 035 $a(CaONFJC)MIL100979 035 $a(OCoLC)936903375 035 $a(EXLCZ)991000000000349961 100 $a20050817d2005 fy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aDemystifying chipmaking$b[electronic resource] /$fby Richard F. Yanda, Michael Heynes and Anne K. Miller 210 $aOxford $cNewnes ;$aAmsterdam $cElsevier$d2005 215 $a1 online resource (276 p.) 300 $aDescription based upon print version of record. 311 $a0-7506-7760-0 320 $aIncludes bibliographical references and index. 327 $aCover; Contents; Foreword; Acknowledgments; About the Authors; Chapter 1: IC Fabrication Overview; Section 1: Introduction; 1.1 Integrated Circuits; 1.2 The Semiconductor Industry; Section 2: Support Technologies; 2.1 Crystal Growth and Wafer Preparation; 2.2 Contamination Control; 2.3 Circuit Design and Mask Making; 2.4 Process Diagnostics and Metrology; Section 3: Integrated Circuit Fabrication; 3.1 Layering; 3.2 Patterning; 3.3 Doping; 3.4 Process Control and In-line Monitoring; Section 4: Test and Assembly; 4.1 Electrical Tests; 4.2 Die Separation; 4.3 Die Attach and Wire Bonding 327 $a4.4 Encapsulation4.5 Final Test; Section 5: Summary; Chapter 2: Support Technologies; Section 1: Introduction; Section 2: Contamination Control; 2.1 Why Control Contamination?; 2.2 Contamination Sources; 2.3 The Cleanroom; Section 3: Crystal Growth and Wafer Preparation; 3.1 Introduction; 3.2 Silicon Purification; 3.3 Czochralski Silicon Growth; 3.4 Shaping, Grinding, Cutting and Polishing; 3.5 Final Inspection and Shipping; Section 4: Circuit Design; 4.1 Introduction; 4.2 Product Definition and New Product Plan; 4.3 The Design Team; 4.4 The Design Process; 4.5 Design Verification and Tapeout 327 $aSection 5: Photomask and Reticle Preparation5.1 Introduction; 5.2 Reticle Substrate Preparation; 5.3 Pattern Transfer; 5.4 Inspection and Defect Repair; Chapter 3: Forming Wells; Section 1: Introduction; Section 2: Initial Oxidation; Section 3: Photolithography; 3.1 Introduction; 3.2 Coat (Spin); 3.3 Exposure (Step); 3.4 Develop; 3.5 After Develop Inspect (ADI); Section 4: Ion Implantation; Chapter 4: Isolate Active Areas (Shallow Trench Isolation); Section 1: Introduction to Shallow Trench Isolation; Section 2: Pad Oxide Growth; Section 3: Silicon Nitride Deposition 327 $aSection 4: Photolithography for Photo/EtchSection 5: Hard Mask Formation Using Plasma Etch; 5.1 Hard Mask Overview; 5.2 Plasma Etch Overview; 5.3 Etch Chemistry: Silicon Dioxide and Silicon Nitride; Section 6: Form Trenches in Silicon with Plasma Etch; Section 7: Fill Trenches with Silicon Dioxide; Section 8: Chemical Mechanical Polishing (CMP) to Remove Excess Dioxide; Section 9: Wet Etch Removal of Silicon Nitride and Pad Oxide; Chapter 5: Building the Transistors; Section 1: Introduction; Section 2: Thin Film Formation; 2.1 Gate Dielectric Oxidation 327 $a2.2 Polycrystalline Silicon (Poly) Deposition2.3 Nitride Cap Deposition; Section 3: Poly Gate Formation; 3.1 Photoresist Patterning; 3.2 Plasma Etch; Section 4: Source/Drain Formation; 4.1 Introduction; 4.2 Shallow Implant; 4.3 Spacer Formation; 4.4 High-Dose Implant; 4.5 Anneal; Section 5: Salicide Formation; 5.1 Sputter Cobalt; 5.2 RTP Reaction Forming Silicide; 5.3 Strip Residual Cobalt; 5.4 Anneal the Silicide; Chapter 6: First Level Metallization; Section 1: Introduction; Section 2: Nitride and Oxide Depositions; 2.1 Nitride Deposition; 2.2 Oxide Deposition; Section 3: CMP Planarization 327 $aSection 4: Photo/Etch for Contact Holes 330 $aThis book takes the reader through the actual manufacturing process of making a typical chip, from start to finish, including a detailed discussion of each step, in plain language. The evolution of today's technology is added to the story, as seen through the eyes of the engineers who solved some of the problems. The authors are well suited to that discussion since they are three of those same engineers. They have a broad exposure to the industry and its technology that extends all the way back to Shockley Laboratories, the first semiconductor manufacturer in Silicon Valley.The CMOS (C 606 $aLogic circuits$xDesign and construction 606 $aMetal oxide semiconductors, Complementary 615 0$aLogic circuits$xDesign and construction. 615 0$aMetal oxide semiconductors, Complementary. 676 $a621.39732 700 $aYanda$b Richard F$01498180 701 $aHeynes$b Michael$01498181 701 $aMiller$b Anne K$0125426 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910784359603321 996 $aDemystifying chipmaking$93723654 997 $aUNINA