LEADER 05640nam 2200697 a 450 001 9910784353303321 005 20230120004358.0 010 $a1-281-03653-6 010 $a9786611036539 010 $a0-08-055119-X 035 $a(CKB)1000000000349861 035 $a(EBL)311527 035 $a(OCoLC)476099073 035 $a(SSID)ssj0000264372 035 $a(PQKBManifestationID)11246780 035 $a(PQKBTitleCode)TC0000264372 035 $a(PQKBWorkID)10291681 035 $a(PQKB)10468236 035 $a(Au-PeEL)EBL311527 035 $a(CaPaEBR)ebr10190067 035 $a(CaONFJC)MIL103653 035 $a(CaSebORM)9780750679442 035 $a(MiAaPQ)EBC311527 035 $a(EXLCZ)991000000000349861 100 $a20070605d2007 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aUnderstanding fabless IC technology$b[electronic resource] /$fJeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya 205 $a1st edition 210 $aAmsterdam ;$aBoston $cElsevier/Newnes$dc2007 215 $a1 online resource (294 p.) 225 1 $aCommunications engineering series 300 $aDescription based upon print version of record. 311 $a0-7506-7944-1 320 $aIncludes bibliographical references (p. 243-245) and index. 327 $aFront Cover; Understanding Fabless IC Technology; Copyright Page; Contents; Acknowledgements; Preface; PART 1 - Manufacturing Strategies: Understanding Fabless IC Technology; Chapter 1: More than a Decade of Transition in the Semiconductor Industry; 1.1 FSA is Established; 1.2 Early Success; 1.3 Early Success Trend Continues; 1.4 Semiconductor Business Models; 1.5 Outsourcing Will Accelerate; 1.6 IDMs are Going Fabless; 1.7 A Case Study: Cypress Semiconductor; 1.8 More IDMs are Outsourcing; 1.9 Geographic Manufacturing Centers; Chapter 2: Fabless Semiconductor Manufacturing 327 $a2.1 Foundry Revenue Growth2.2 Semiconductor Back-End Services; 2.3 Semiconductor Equipment; Chapter 3: Qualities of Successful Fabless Companies; 3.1 Defining Events for the Fabless Market; 3.2 Thriving in the Fabless Model; 3.3 Key Qualities for Success; 3.4 The Future of Fabless; PART 2 - An In-Depth Understanding of the Fabless Semiconductor Business Model; Chapter 4: Semiconductor Manufacturing Basics; 4.1 Semiconductor Processes; 4.2 Semiconductor Manufacturing Steps; 4.3 Wafer Size; 4.4 Manufacturing Costs; 4.5 Conclusion; Chapter 5: Fabless ASICs; 5.1 Introduction 327 $a5.2 Origins of the ASIC Industry5.3 Emergence of the Fabless ASIC Business Model; 5.4 The Fabless ASIC Model: How It Works; 5.5 The Services and Capabilities of a Fabless ASIC Supplier; 5.6 Conclusion; Chapter 6: Electronic Design Automation; 6.1 Fabless EDA Overview; 6.2 Fabless EDA Selection Process; 6.3 Physical Design EDA; Chapter 7: Intellectual Property; 7.1 SIP Industry Overview; 7.2 SIP Business Environment; 7.3 Sourcing SIP Products; 7.4 Baseline Terminology; 7.5 Finding SIP and Related Products; 7.6 Evaluating SIP Business Models; 7.7 SIP Product Enablers 327 $a7.8 Examples by SIP Product Type7.9 Licensing SIP Products; 7.10 Provider and Buyer Perspectives; 7.11 The Evolution of the IP Industry; 7.12 Intellectual Property Considerations; 7.13 IP Outsourcing; 7.14 Making IP Work in the Fabless Semiconductor Community; 7.15 IP Acquisition Considerations for Fabless IC Companies; Chapter 8: e-Commerce; 8.1 The Virtual Fab Challenge; 8.2 Semiconductor & Fabless Manufacturing: What is Different?; 8.3 ""Build to Forecast"" for Outsourced Manufacturing; 8.4 ERP System Solutions; 8.5 The Information Ecosystem: Where Communication is Key 327 $aChapter 9: Quality and Reliability9.1 General; 9.2 Front-End; 9.3 Back-End; 9.4 Environment, Health and Safety; Chapter 10: Test Development; 10.1 Simplifying Outsourced Test Development; 10.2 Preparation; 10.3 Evaluation; 10.4 Conclusion; PART 3 - Becoming a Best-in-Class Fabless Company; Chapter 11: Best Practices for Fabless Companies; 11.1 Achieving Best-in-Class Operations Practices; 11.2 A Foundry Manager's Role in a Fabless Company; 11.3 Closing the Loop: Understanding the Manufacturing Flow; 11.4 Managing a Virtual Manufacturing Chain; Chapter 12: Building the Right Partnerships 327 $a12.1 Suppliers are (Almost) Just as Important as Customers 330 $aFabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. "Fabless? ICs are 410 0$aCommunications engineering series. 606 $aIntegrated circuits$xDesign and construction 606 $aIntegrated circuits industry 615 0$aIntegrated circuits$xDesign and construction. 615 0$aIntegrated circuits industry. 676 $a621.3815 700 $aHurtarte$b Jeorge S$01511547 701 $aWolsheimer$b Evert A$01511548 701 $aTafoya$b Lisa M$01511549 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910784353303321 996 $aUnderstanding fabless IC technology$93744894 997 $aUNINA