LEADER 04595nam 2200565 a 450 001 9910779657003321 005 20230802010337.0 010 $a1-68015-512-1 010 $a1-61503-995-3 035 $a(CKB)2550000001039745 035 $a(EBL)3002469 035 $a(SSID)ssj0001178381 035 $a(PQKBManifestationID)11764374 035 $a(PQKBTitleCode)TC0001178381 035 $a(PQKBWorkID)11168570 035 $a(PQKB)11048187 035 $a(MiAaPQ)EBC3002469 035 $a(Au-PeEL)EBL3002469 035 $a(CaPaEBR)ebr10627944 035 $a(OCoLC)929147927 035 $a(EXLCZ)992550000001039745 100 $a20121211d2012 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aISTFA 2012$b[electronic resource] $econference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA 210 $aMaterials Park, Ohio $cASM International$d2012 215 $a1 online resource (642 p.) 300 $aDescription based upon print version of record. 311 $a1-61503-979-1 320 $aIncludes bibliographical references and index. 327 $a""Title Page""; ""Copyright""; ""Board of Directors""; ""Organizing Committee""; ""Symposium Committee""; ""User Groups""; ""Contents""; ""2012 IPFA Best Paper""; ""Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI""; ""Emerging Concepts and Techniques""; ""Closer to the Theoretical Limit: Spherical Corrections to Aplanatic Solid Immersion Imaging with Adaptive Optics""; ""Fault Isolation of Open Defects Using Space Domain Reflectometry""; ""Localization of Dead Open in a Solder Bump by Space Domain Reflectometry"" 327 $a""Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package""""Novel Plasma FIB/SEM for High Speed Failure Analysis and Real Time Imaging of Large Volume Removal""; ""FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices""; ""Fault Isolation and Failure Analysis of TSV""; ""Cross Section Analysis of Cu Filled TSVs Based On High Throughput Plasma- FIB Milling""; ""Microstructural Considerations on the Reliability of 3D Packaging"" 327 $a""High-Frequency TSV Failure Detection Method with Z Parameter""""Enhanced Failure Analysis on Open TSV Interconnects""; ""Nanoprobing Techniques""; ""A New Technique for Non-Invasive Short-Localisation in Thin Dielectric Layers by Electron Beam Absorbed Current (EBAC) Imaging""; ""Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing""; ""In FAB 300 mm Wafer Level Atomic Force Probe Characterization""; ""Nanoelectronic Analog Circuit PFA a??? The Return of Circuit Level Probing""; ""Fault Isolation and Failure Analysis of 3D Packages"" 327 $a""Enhanced Comparison of Lock-in Thermography and Magnetic Microscopy for 3D Defect Localization of System in Packages""""Non Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-ray Computed Tomography""; ""Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies""; ""Nanoprobing Applications""; ""Analysis of an Anomalous Transistor Exhibiting Dual-Vt Characteristics and Its Cause in a 90 nm Node CMOS Technology"" 327 $a""Study of Static Noise Margin, Cell Stability and Influence of Electron Beam on Sub-30 nm SRAM Using SEM-Based Nanoprobing with 8 Nanoprobes""""Leaky Device Channel Anomaly Identification and Case Study by Nano-Probing Technique, Curve Fitting, and Model Analysis""; ""Photon Based Techniques: An Understanding""; ""Photon Emission Spectra of FETs as Obtained by InGaAs Detector""; ""Near-Infrared Photon Emission Spectroscopy Trends in Scaled SOI Technologies"" 327 $a""Characterization and TCAD Simulation of 90 nm Technology PMOS Transistor Under Continuous Photoelectric Laser Stimulation for Failure Analysis Improvement"" 606 $aElectronics$xMaterials$xTesting$vCongresses 606 $aElectronic apparatus and appliances$xTesting$vCongresses 615 0$aElectronics$xMaterials$xTesting 615 0$aElectronic apparatus and appliances$xTesting 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910779657003321 996 $aISTFA 2012$93792426 997 $aUNINA LEADER 01265nam2 2200289 i 450 001 VAN00076697 005 20240806100610.940 100 $a20100924d1970 |0itac50 ba 101 $aita 102 $aIT 105 $a|||| ||||| 200 1 $aˆ1: ‰Libro 4. : (artt.1173-1320)$fa cura di Giorgio Stella Richter e Paolo Vitucci 205 $aNuova ed. riveduta e aggiornata 210 $a Milano$cA. Giuffrè$d1970 215 $a854 p.$d25 cm 316 $aFondo Tribunale$5IT-IT-CE0105 CONSXV.D.51.4(1173-1320) 461 1$1001VAN00045754$12001 $aRassegna di giurisprudenza sul codice civile$fdiretta da Rosario Nicolò, Mario Stella Richter$1210 $aMilano$cGiuffrè$1215 $avolumi$d25 cm$v4.1 620 $dMilano$3VANL000284 702 1$aStella Richter$bGiorgio$3VANV002590 702 1$aVitucci$bPaolo$3VANV004356 712 $aGiuffrè $3VANV109181$4650 801 $aIT$bSOL$c20251114$gRICA 899 $aBIBLIOTECA DEL DIPARTIMENTO DI GIURISPRUDENZA$1IT-CE0105$2VAN00 912 $aVAN00076697 950 $aBIBLIOTECA DEL DIPARTIMENTO DI GIURISPRUDENZA$d00CONS XV.D.51.4 (1173-1320) $e00FT 33731 20100924 Fondo Tribunale 996 $aLibro 4. : (artt.1173-1320)$94208194 997 $aUNICAMPANIA