LEADER 02497nam 22005175 450 001 996309052003316 005 20231110221039.0 010 $a3-11-162109-X 024 7 $a10.1515/9783111621098 035 $a(CKB)4100000007881439 035 $a(DE-B1597)114327 035 $a(OCoLC)1091664707 035 $a(DE-B1597)9783111621098 035 $aEBL7015062 035 $a(AU-PeEL)EBL7015062 035 $a(oapen)https://directory.doabooks.org/handle/20.500.12854/46011 035 $a(MiAaPQ)EBC7015062 035 $a(EXLCZ)994100000007881439 100 $a20191022d2019 fg 101 0 $ager 135 $aur||||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aEinführung in das Programmieren in BASIC /$fErich W. Mägerle 205 $aReprint 2019 210 $cDe Gruyter$d1974 210 1$aBerlin ;$aBoston : $cDe Gruyter, $d[2019] 210 4$d©1974 215 $a1 online resource (112 p.) $cZahlr. Abb 225 0 $aDe Gruyter Lehrbuch 300 $aDescription based upon print version of record. 311 $a3-11-004801-9 327 $tFrontmatter -- $tInhaltsverzeichnis -- $t0. Einleitung -- $t1. BASIC-Ausdrücke -- $t2. Eingabe-Anweisungen -- $t3. Ausgabe-Anweisungen -- $t4. ERGIBT-Anweisungen -- $t5. Schleifen-Steuerung-Anweisung -- $t6. Verzweigungs-Anweisungen -- $t7. Das Definieren von Bereichen -- $t8. Kommentierung eines Programmes -- $t9. Hinzufügen von Programmsegmenten -- $t10. Stoppen der Programmausführung -- $t11. Verbindung von Hauptprogrammen -- $t12. Anhang -- $tStichwortverzeichnis 330 $aTo celebrate the 270th anniversary of the De Gruyter publishing house, the company is providing permanent open access to 270 selected treasures from the De Gruyter Book Archive. Titles will be made available to anyone, anywhere at any time that might be interested. The DGBA project seeks to digitize the entire backlist of titles published since 1749 to ensure that future generations have digital access to the high-quality primary sources that De Gruyter has published over the centuries. 410 3$aDe Gruyter Lehrbuch 606 $aCOMPUTERS / General$2bisacsh 615 7$aCOMPUTERS / General. 676 $a005.13 700 $aMägerle$b Erich W., $0926298 801 0$bDE-B1597 801 1$bDE-B1597 906 $aBOOK 912 $a996309052003316 996 $aEinführung in das Programmieren in BASIC$92079849 997 $aUNISA LEADER 03223nam 2200757 a 450 001 9910779079303321 005 20221206161302.0 010 $a1-78268-088-8 010 $a1-283-89292-8 010 $a1-60649-258-6 024 7 $a10.4128/9781606492581 035 $a(CKB)2550000000086627 035 $a(EBL)876650 035 $a(OCoLC)774870137 035 $a(SSID)ssj0000621186 035 $a(PQKBManifestationID)11374174 035 $a(PQKBTitleCode)TC0000621186 035 $a(PQKBWorkID)10616809 035 $a(PQKB)10296359 035 $a(CaBNVSL)swl00400444 035 $a(Au-PeEL)EBL876650 035 $a(CaPaEBR)ebr10528319 035 $a(CaONFJC)MIL420542 035 $a(CaSebORM)9781606492574 035 $a(MiAaPQ)EBC876650 035 $a(EXLCZ)992550000000086627 071 53$a2$bBEP 100 $a20120125d2012 fy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aPricing segmentation and analytics$b[electronic resource] /$fTudor Bodea and Mark Ferguson 205 $a1st ed. 210 $a[New York, N.Y.] (222 East 46th Street, New York, NY 10017) $cBusiness Expert Press$dc2012 215 $a1 online resource (173 p.) 225 1 $aMarketing strategy collection,$x2150-9662 300 $aDescription based upon print version of record. 311 $a1-60649-257-8 320 $aIncludes bibliographical references (p. 147-151) and index. 327 $a1. Theory of pricing analytics -- 2. The practice of pricing analytics -- 3. Dynamic pricing and markdown optimization -- 4. Pricing in business-to-business environments -- 5. Customer behavior aspects of pricing -- Appendix A. Dichotomous logistic regression -- Appendix B. Pricing analytics using R -- Notes -- References -- Index. 330 3 $aPricing analytics uses historical sales data with mathematical optimization to set and update prices offered through various channels in order to maximize profit. A familiar example is the passenger airline industry, where a carrier may sell seats on the same flight at many different prices. Pricing analytics practices have transformed the transportation and hospitality industries and are increasingly important in industries as diverse as retail, telecommunications, banking, health care, and manufacturing. The aim of this book is to guide students and professionals on how to identify and exploit pricing opportunities in different business contexts. 410 0$aMarketing strategy collection.$x2150-9662 606 $aPricing 606 $aRevenue management 606 $aMarket segmentation 610 $aSegmentation 610 $arevenue management 610 $aprice optimization 610 $aprice elasticity 610 $apromotions 610 $apricing 615 0$aPricing. 615 0$aRevenue management. 615 0$aMarket segmentation. 676 $a658.816 700 $aBodea$b Tudor$01478749 701 $aFerguson$b Mark$01478750 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910779079303321 996 $aPricing segmentation and analytics$93694555 997 $aUNINA LEADER 05532nam 2200709Ia 450 001 9911019406703321 005 20200520144314.0 010 $a9786611843144 010 $a9781281843142 010 $a1281843148 010 $a9783527617746 010 $a3527617744 010 $a9783527617753 010 $a3527617752 035 $a(CKB)1000000000377066 035 $a(EBL)481335 035 $a(OCoLC)289075526 035 $a(SSID)ssj0000120436 035 $a(PQKBManifestationID)11146453 035 $a(PQKBTitleCode)TC0000120436 035 $a(PQKBWorkID)10102320 035 $a(PQKB)11182201 035 $a(MiAaPQ)EBC481335 035 $a(PPN)153531282 035 $a(Perlego)2753818 035 $a(EXLCZ)991000000000377066 100 $a19960213d2004 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aChemical mechanical planarization of microelectronic materials /$fJoseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann 210 $aWeinheim $cWiley-VCH$d2004 215 $a1 online resource (339 p.) 300 $aDescription based upon print version of record. 311 08$a9780471138273 311 08$a0471138274 320 $aIncludes bibliographical references and index. 327 $aChemical Mechanical Planarization of Microelectronic Materials; CONTENTS; Preface; 1 Chemical Mechanical Planarization - An Introduction; 1.1 Introduction; 1.2 Applications; 1.3 The CMP Process; 1.4 CMP Tools; 1.5 Process Integration; 1.6 Conclusion and Book Outline; References; 2 Historical Motivations for CMP; 2.1 Advanced Metallization Schemes; 2.1.1 Interconnect Delay Impact on Performance; 2.1.2 Methods of Reducing Interconnect Delay; 2.1.3 Planarity Requirements for Multilevel Metallization; 2.2 Planarization Schemes; 2.2.1 Smoothing and Local Planarization; 2.2.2 Global Planarization 327 $a2.3 CMP Planarization2.3.1 Advantages of CMP; 2.3.2 Disadvantages of CMP; 2.3.3 The Challenge of CMP; References; 3 CMP Variables and Manipulations; 3.1 Output Variables; 3.2 Input Variables; References; 4 Mechanical and Electrochemical Concepts for CMP; 4.1 Preston Equation; 4.2 Fluid Layer Interactions; 4.3 Boundary Layer Interactions; 4.3.1 Fluid Boundary Layer; 4.3.2 Double Layer; 4.3.3 Metal Surface Films; 4.3.4 Mechanical Abrasion; 4.4 Abrasion Modes; 4.4.1 Polishing vs. Grinding; 4.4.2 Hertzian Indentation vs. Fluid-Based Wear; 4.5 The Polishing Pad; 4.5.1 Pad Materials and Properties 327 $a4.5.2 Pad Conditioning4.6 Electrochemical Phenomena; 4.6.1 Reduction-Oxidation Reactions; 4.6.2 Pourbaix Diagrams; 4.6.3 Mixed Potential Theory; 4.6.4 Example: Copper CMP in NH3-Based Slurries; 4.6.5 Example: Copper-Titanium Interaction; 4.7 Role of Chemistry in CMP; 4.8 Abrasives; References; 5 Oxide CMP Processes - Mechanisms and Models; 5.1 The Role of Chemistry in Oxide Polishing; 5.1.1 Glass Polishing Mechanisms; 5.1.2 The Role of Water in Oxide Polishing; 5.1.3 Chemical Interactions Between Abrasive and Oxide Surface; 5.2 Oxide CMP in Practice; 5.2.1 Polish Rate Results 327 $a5.2.2 Planarization Results5.2.3 CMP in Manufacturing; 5.2.4 Yield Issues; 5.3 Summary; References; 6 Tungsten and CMP Processes; 6.1 Inlaid Metal Patterning; 6.1.1 RIE Etch Back; 6.1.2 Metal CMP; 6.2 Tungsten CMP; 6.2.1 Surface Passivation Model for Tungsten CMP; 6.2.2 Tungsten CMP Processes; 6.3 Summary; References; 7 Copper CMP; 7.1 Proposed Model for Copper CMP; 7.2 Surface Layer Formation - Planarization; 7.2.1 Formation of Native Surface Films; 7.2.2 Formation of Nonnative Cu-BTA Surface Film; 7.3 Material Dissolution; 7.3.1 Removal of Abraded Material 327 $a7.3.2 Increasing Solubility with Complexing Agent7.3.3 Increasing Dissolution Rate with Oxidizing Agents; 7.3.4 Chemical Aspect of the Copper CMP Model; 7.4 Preston Equation; 7.4.1 Preston Coefficient; 7.4.2 Polish Rates; 7.4.3 Comparison of Kp Values; 7.5 Polish-Induced Stress; 7.6 Pattern Geometry Effects; 7.6.1 Dishing and Erosion in Cu/SiO2 System; 7.6.2 Optimization of Process to Minimize Dishing and Erosion; 7.6.3 Summary; References; 8 CMP of Other Materials and New CMP Applications; 8.1 The Front-End Applications in Silicon IC Fabrication 327 $a8.1.1 Polysilicon CMP for Deep Trench Capacitor Fabrication 330 $aChemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now.Chemica 606 $aMicroelectronics$xMaterials 606 $aGrinding and polishing 615 0$aMicroelectronics$xMaterials. 615 0$aGrinding and polishing. 676 $a621.3815 676 $a621.38152 700 $aSteigerwald$b Joseph M$01841102 701 $aMurarka$b S. P$0463885 701 $aGutmann$b Ronald J$01841103 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9911019406703321 996 $aChemical mechanical planarization of microelectronic materials$94420721 997 $aUNINA