LEADER 03362nam 2200625Ia 450 001 9910450385003321 005 20200520144314.0 010 $a1-280-54757-X 010 $a9786610547579 010 $a1-84663-011-8 035 $a(CKB)1000000000242843 035 $a(EBL)267393 035 $a(OCoLC)71174790 035 $a(SSID)ssj0000671747 035 $a(PQKBManifestationID)11384635 035 $a(PQKBTitleCode)TC0000671747 035 $a(PQKBWorkID)10625146 035 $a(PQKB)11705436 035 $a(MiAaPQ)EBC267393 035 $a(Au-PeEL)EBL267393 035 $a(CaPaEBR)ebr10132649 035 $a(CaONFJC)MIL54757 035 $a(OCoLC)133162498 035 $a(EXLCZ)991000000000242843 100 $a20000815d2006 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aAdvanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging$b[electronic resource] /$fguest editors Christopher Bailey and Johan Liu 210 $aBradford, England $cEmerald Group Publishing$dc2006 215 $a1 online resource (72 p.) 225 0 $aSoldering & surface mount technology ;$vv.18, no. 2 300 $aDescription based upon print version of record. 311 $a1-84663-010-X 327 $aCover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder 327 $aFinite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary 330 $aThis issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i 410 0$aSoldering & surface mount technology ;$vv.18, no. 2. 606 $aManufacturing processes 606 $aElectronic packaging 608 $aElectronic books. 615 0$aManufacturing processes. 615 0$aElectronic packaging. 676 $a621.381/046 701 $aBailey$b Christopher$0924607 701 $aLiu$b Johan$0924733 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910450385003321 996 $aAdvanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging$92075654 997 $aUNINA LEADER 02757nam 2200601 a 450 001 9910778751403321 005 20230124180844.0 010 $a1-280-18675-5 010 $a9786610186754 010 $a0-309-59201-1 010 $a0-585-14940-2 035 $a(CKB)110986584752330 035 $a(SSID)ssj0000260571 035 $a(PQKBManifestationID)11194743 035 $a(PQKBTitleCode)TC0000260571 035 $a(PQKBWorkID)10193173 035 $a(PQKB)11569480 035 $a(MiAaPQ)EBC3376392 035 $a(Au-PeEL)EBL3376392 035 $a(CaPaEBR)ebr10055590 035 $a(CaONFJC)MIL18675 035 $a(OCoLC)923263438 035 $a(EXLCZ)99110986584752330 100 $a19990113d1998 uy 0 101 0 $aeng 135 $aurcn||||||||| 181 $ctxt 182 $cc 183 $acr 200 00$aToward an Earth Science Enterprise federation$b[electronic resource] $eresults from a workshop /$fSteering Committee for a Workshop on an Earth Science Enterprise Federation, Committee on Geophysical and Environmental Data, Board on Earth Sciences and Resources, Commission on Geosciences, Environment, and Resources, National Research Council 210 $aWashington, D.C. $cNational Academy Press$dc1998 215 $ax, 51 p 300 $aBottom on cover title: National Research Council. 300 $aCopyright: National Academy of Sciences. 300 $a"Steering Committee ... Thomas R. Karl, National Climatic Data Center"--P. iii. 300 $a"Following individuals ... review of this report, ... Kenneth D. Davidson, National Climatic Data Center, .... responsibility for the final content of this report rests solely with the authoring committee and the NRC"--P. viii. 300 $a"Goal of NASA's Earth Science Enterprise (ESE) is to enhance understanding ... at a variety of temporal and spatial scales. At the heart ... is the Earth Observing System .... federation concept is a reversal of NASA's traditional data management approach, because it places power and authority at the lowest level possible."--P. 1. 311 $a0-309-06134-2 320 $aIncludes bibliographical references (p. 19). 606 $aEarth sciences$xResearch$zUnited States$xManagement$vCongresses 615 0$aEarth sciences$xResearch$xManagement 676 $a550/.285 701 $aKarl$b Thomas$01128845 712 02$aUnited States.$bNational Aeronautics and Space Administration. 712 02$aNational Academy of Sciences (U.S.) 712 02$aNational Research Council (U.S.) 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910778751403321 996 $aToward an Earth Science Enterprise federation$93797521 997 $aUNINA