LEADER 00703nam a2200205 a 4500 001 991002663939707536 008 070719s2003 it a 000 0 ita d 035 $ab13561819-39ule_inst 040 $aDip.to SSC$bita 082 0 $a891.9913 100 1 $aKasoruho, Amik$0527320 245 10$aTra carcere e Dio /$cAmik Kasoruho 260 $aMaglie :$bAgimi,$c2003 300 $a141 p. :$bill. ;$c21 cm 907 $a.b13561819$b19-07-07$c19-07-07 912 $a991002663939707536 945 $aLE021 SOC25F141$g1$i2021000108563$lle021$nZa$o-$pE0.00$q-$rn$sm $t0$u0$v0$w0$x0$y.i14518715$z19-07-07 996 $aTra carcere e Dio$91218540 997 $aUNISALENTO 998 $ale021$b19-07-07$cm$da $e-$fita$git $h0$i0 LEADER 04775nam 2200613 450 001 9910830719103321 005 20230201160838.0 010 $a1-281-84244-3 010 $a9786611842444 010 $a3-527-61280-7 010 $a3-527-61281-5 035 $a(CKB)1000000000376238 035 $a(EBL)481671 035 $a(OCoLC)289096549 035 $a(SSID)ssj0000097287 035 $a(PQKBManifestationID)11122250 035 $a(PQKBTitleCode)TC0000097287 035 $a(PQKBWorkID)10115050 035 $a(PQKB)10258688 035 $a(PQKBManifestationID)10022966 035 $a(OCoLC)45316357 035 $a(PQKB)20706050 035 $a(MiAaPQ)EBC481671 035 $a(EXLCZ)991000000000376238 100 $a20160818h20012001 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aAdhesives and adhesive tapes /$fGerhard Gierenz, Werner Karmann, (editors) 210 1$aWeinheim, [Germany] :$cWiley-VCH,$d2001. 210 4$d©2001 215 $a1 online resource (148 p.) 300 $aIncludes index. 311 $a3-527-30110-0 327 $aAdhesives and Adhesive Tapes; Contents; 1. Adhesives; 1.1. Introduction; 1.2. Adhesion Theories; 1.3. Definitions; 1.4. Raw Materials for Adhesives; 1.5. Classification of Adhesives; 1.6. Individual Adhesive Systems; 1.6.1. Adhesives That Set Without a Chemical Reaction; 1.6.1.1. Solvent-Free Adhesive Systems; 1.6.1.2. Adhesive Solutions from Which the Solvents Escape before Bonding; 1.6.1.3. Adhesive Solutions from Which the Solvents Evaporate during Bonding; 1.6.1.4. Aqueous Emulsions of Polymeric Compounds; 1.6.2. Adhesives Setting by Chemical Reaction 327 $a1.6.2.1. Adhesives Setting by Polymerization1.6.2.2. Adhesives Setting by Polyaddition; 1.6.2.3. Adhesives Setting by Polycondensation; 1.6.2.4. Vulcanizing Adhesives; 1.6.2.5. Ultraviolet/Electron Beam (UV/EB) Curing Adhesives; 1.6.2.6. Conductive Adhesives; 1.7. Bonding Techniques; 1.8. Testing of Adhesives; 1.9. Applications of Adhesives; 1.9.1. Bookbinding; 1.9.2. Adhesives for Packaging and Packaging Materials; 1.9.3. Nonwovens Hygiene Industry; 1.9.4. Hygienic Papers; 1.9.5. Gluing of Wood and Wooden Materials; 1.9.6. Footwear Adhesives; 1.9.7. Bonding of Plastics 327 $a1.9.8. Bonding of Elastomers1.9.8.1. Adhesion of Rubber; 1.9.8.2. Bonding of Rubber; 1.9.9. Bonding of Metals; 1.9.10. Adhesives for Wallcoverings; 1.9.11. Floorcovering Adhesives; 1.9.12. Building Construction Adhesives; 1.9.13. Adhesives for Bonding Textile Fabrics; 1.9.14. Flocking Adhesives; 1.9.15. Adhesives for Bonding Glass; 1.9.16. Adhesives in Automobile Manufacture; 1.9.17. Adhesives in Aircraft Construction; 1.9.18. Adhesives and Sealants in Electronics; 1.9.19. Medical Adhesives; 1.9.20. Household Adhesives; 1.9.21. Applications of Anaerobic Adhesives; 1.10. Economic Aspects 327 $a2. Adhesive Tapes2.1. Introduction; 2.2. Pressure-Sensitive Adhesion; 2.2.1. Mechanism of Pressure-Sensitive Adhesion; 2.2.2. Dynamic Mechanical Analysis; 2.3. Test Methods; 2.4. Raw Materials; 2.4.1. Elastomers; 2.4.2. Tackifier Resins; 2.4.3. Plasticizers; 2.4.4. Fillers; 2.4.5. Stabilizers; 2.4.6. Release Coatings; 2.5. Manufacturing Processes; 2.5.1. Compounding; 2.5.2. Coating; 2.5.3. Drying; 2.5.4. Cross-linking/ Curing; 2.5.5. Slitting, Cutting; 2.6. Adhesive Tape Products; 2.6.1. One-sided Adhesive Tapes; 2.6.1.1. Film Tapes; 2.6.1.2. Fiber-Reinforced Tapes; 2.6.1.3. Paper Tapes 327 $a2.6.1.4. Textile Tapes2.6.1.5. Other Backings; 2.6.1.6. Electrical Tapes; 2.6.2. Double-Sided Adhesive Tapes; 2.6.2.1. Standard Double-Sided Tapes; 2.6.2.2. Transfer Tapes; 2.6.2.3. Adhesive Pads and Strips; 2.6.2.4. High-Performance Tapes; 2.6.3. Medical Tapes; 2.7. References; Subject index 330 $aAdhesion is among the oldest technologies known to mankind, but the technology of adhesives began to boom with the developments in chemistry in the early 1900s.The last few years have seen tremendous progress in the performance of adhesives, allowing two pieces to be connected inseparably. Modern adhesives perform so well that more sophisticated joining methods, e.g. welding, can often be replaced by adhesion, meaning that adhesives have found new areas of application. This book allows readers to quickly gain an overview of the adhesives available and to select the best adhesive for each p 606 $aAdhesives 615 0$aAdhesives. 676 $a668.3 676 $a668/.3 702 $aGierenz$b Gerhard 702 $aKarmann$b Werner 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 912 $a9910830719103321 996 $aAdhesives and adhesive tapes$93932224 997 $aUNINA LEADER 04135nam 22008895 450 001 9910743684503321 005 20250407215719.0 010 $a9783031434334 010 $a3031434331 024 7 $a10.1007/978-3-031-43433-4 035 $a(MiAaPQ)EBC30728635 035 $a(Au-PeEL)EBL30728635 035 $a(DE-He213)978-3-031-43433-4 035 $a(PPN)272735795 035 $a(CKB)28152178500041 035 $a(OCoLC)1396697976 035 $a(EXLCZ)9928152178500041 100 $a20230904d2023 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aBusiness Process Management: Blockchain, Robotic Process Automation and Educators Forum $eBPM 2023 Blockchain, RPA and Educators Forum, Utrecht, The Netherlands, September 11?15, 2023, Proceedings /$fedited by Julius Köpke, Orlenys López-Pintado, Ralf Plattfaut, Jana-Rebecca Rehse, Katarzyna Gdowska, Fernanda Gonzalez-Lopez, Jorge Munoz-Gama, Koen Smit, Jan Martijn E. M. van der Werf 205 $a1st ed. 2023. 210 1$aCham :$cSpringer Nature Switzerland :$cImprint: Springer,$d2023. 215 $a1 online resource (274 pages) 225 1 $aLecture Notes in Business Information Processing,$x1865-1356 ;$v491 311 08$aPrint version: Köpke, Julius Business Process Management: Blockchain, Robotic Process Automation and Educators Forum Cham : Springer,c2023 9783031434327 327 $aBlockchain Forum -- RPA Forum -- Educators Forum. 330 $aThis book constitutes the proceedings of the BPM Forum held at the 21st International Conference on Business Process Management, BPM 2023, which took place in Utrecht, The Netherlands, in September 2023. The Blockchain Forum provided a platform for exploring and discussing innovative ideas on the intersection of BPM and blockchain technology. The RPA Forum focused on the use of the Robotic Process Automation (RPA) in the field of Business Process Management. The Educators Forum brought together educators within the BPM community for sharing resources to improve the practice of teaching BPM-related topics. 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