LEADER 01657nam 2200445 450 001 9910735388803321 005 20221227213134.0 010 $a3-030-98229-7 035 $a(MiAaPQ)EBC7023523 035 $a(Au-PeEL)EBL7023523 035 $a(CKB)24094359900041 035 $a(EXLCZ)9924094359900041 100 $a20221227d2022 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$a3D interconnect architectures for heterogeneous technologies $emodeling and optimization /$fLennart Bamberg [and three others] 210 1$aCham, Switzerland :$cSpringer,$d[2022] 210 4$dİ2022 215 $a1 online resource (403 pages) 311 08$aPrint version: Bamberg, Lennart 3D Interconnect Architectures for Heterogeneous Technologies Cham : Springer International Publishing AG,c2022 9783030982287 320 $aIncludes bibliographical references (pages 383-395). 517 3 $aThree-dimensional interconnect architectures for heterogeneous technologies 606 $aInterconnects (Integrated circuit technology) 606 $aSystems on a chip 606 $aThree-dimensional integrated circuits 615 0$aInterconnects (Integrated circuit technology) 615 0$aSystems on a chip. 615 0$aThree-dimensional integrated circuits. 676 $a621.3815 700 $aBamberg$b Lennart$01376503 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910735388803321 996 $a3D interconnect architectures for heterogeneous technologies$93412364 997 $aUNINA