LEADER 04099nam 22006255 450 001 9910728930403321 005 20230601135234.0 010 $a981-9914-55-8 024 7 $a10.1007/978-981-99-1455-5 035 $a(MiAaPQ)EBC30562381 035 $a(Au-PeEL)EBL30562381 035 $a(OCoLC)1381711412 035 $a(DE-He213)978-981-99-1455-5 035 $a(BIP)089067352 035 $a(PPN)272271683 035 $a(EXLCZ)9926821623500041 100 $a20230601d2023 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aMicrowave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology$b[electronic resource] $eDesign and Simulation /$fby Yongle Wu, Weimin Wang 205 $a1st ed. 2023. 210 1$aSingapore :$cSpringer Nature Singapore :$cImprint: Springer,$d2023. 215 $a1 online resource (323 pages) 311 08$aPrint version: Wu, Yongle Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Singapore : Springer,c2023 9789819914548 327 $aIntroduction -- Design and Simulation of Balanced Bandpass Filter -- Design and Simulation of Millimeter-Wave Microstrip Bandpass Filter -- Design and Simulation of Input-Absorptive Bandstop Filter -- Design and Simulation of Impedance-Transforming Power Divider -- Design and Simulation of Bandpass Filtering Marchand Balun. 330 $aThis book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms a complete system from design theory, circuit simulation, full-wave electromagnetic simulation, and fabrication to measurement. Five representative microwave and millimeter-wave passive chips based on TFIPD technology are taken as examples to demonstrate the complete process from theory, design, simulation, fabrication, and measurement, which is comprehensive, systematical, and easy to learn and understand, convenient to operate, and close to the practical application. This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun. This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities. . 606 $aTelecommunication 606 $aElectronics 606 $aElectronic circuits 606 $aMicrowaves, RF Engineering and Optical Communications 606 $aElectronics and Microelectronics, Instrumentation 606 $aElectronic Circuits and Systems 610 $aElectronics 610 $aElectronic Circuits 610 $aMicrowaves 610 $aTechnology & Engineering 615 0$aTelecommunication. 615 0$aElectronics. 615 0$aElectronic circuits. 615 14$aMicrowaves, RF Engineering and Optical Communications. 615 24$aElectronics and Microelectronics, Instrumentation. 615 24$aElectronic Circuits and Systems. 676 $a621.38133 700 $aWu$b Yongle$01365631 701 $aWang$b Weimin$0673866 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910728930403321 996 $aMicrowave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology$93387805 997 $aUNINA