LEADER 03535nam 22005535 450 001 9910720080003321 005 20250417111722.0 010 $a9783031267086$b(electronic bk.) 010 $z9783031267079 024 7 $a10.1007/978-3-031-26708-6 035 $a(MiAaPQ)EBC7242925 035 $a(Au-PeEL)EBL7242925 035 $a(DE-He213)978-3-031-26708-6 035 $a(OCoLC)1378389907 035 $a(PPN)269655913 035 $a(CKB)26540727900041 035 $a(EXLCZ)9926540727900041 100 $a20230428d2023 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aInterconnect Reliability in Advanced Memory Device Packaging /$fby Chong Leong, Gan, Chen-Yu, Huang 205 $a1st ed. 2023. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2023. 215 $a1 online resource (223 pages) 225 1 $aSpringer Series in Reliability Engineering,$x2196-999X 311 08$aPrint version: Gan, Chong Leong Interconnect Reliability in Advanced Memory Device Packaging Cham : Springer International Publishing AG,c2023 9783031267079 327 $aChapter 1: Advanced Memory and Device Packaging -- Chapter 2: Wearout Reliability-based Characterization in Memory Packaging -- Chapter 3: Recycling of Noble Metals Used in Memory Packaging -- Chapter 4: Advanced Flip Chip Packaging -- Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD) -- Chapter 6: Specific Packaging Reliability Testing -- Chapter 7: Reliability Simulation and Modeling in Memory Packaging -- Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications. 330 $aThis book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. 410 0$aSpringer Series in Reliability Engineering,$x2196-999X 606 $aComputers 606 $aElectronic circuits 606 $aHardware Performance and Reliability 606 $aElectronic Circuits and Systems 615 0$aComputers. 615 0$aElectronic circuits. 615 14$aHardware Performance and Reliability. 615 24$aElectronic Circuits and Systems. 676 $a929.605 700 $aGan$b Chong Leong$01355814 702 $aHuang$b Chen-Yu 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 912 $a9910720080003321 996 $aInterconnect Reliability in Advanced Memory Device Packaging$93359884 997 $aUNINA