LEADER 01727oam 2200505 450 001 9910715023203321 005 20201127110818.0 035 $a(CKB)5470000002507775 035 $a(OCoLC)761214156 035 $a(EXLCZ)995470000002507775 100 $a20111115j196808 ua 0 101 0 $aeng 135 $aur||||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aStress-strain behavior of cold-welded copper-copper microjunctions in vacuum as determined from electrical resistance measurements /$fby John S. Przybyszewski 210 1$aWashington, D.C. :$cNational Aeronautics and Space Administration,$dAugust 1968. 215 $a1 online resource (ii, 20 pages) $cillustrations 225 1 $aNASA technical note ;$vTN D-4743 300 $a"August 1968." 320 $aIncludes bibliographical references (pages 19-20). 606 $aStress-strain curves 606 $aCold welding 606 $aCold welding$2fast 606 $aStress-strain curves$2fast 615 0$aStress-strain curves. 615 0$aCold welding. 615 7$aCold welding. 615 7$aStress-strain curves. 700 $aPrzybyszewski$b John S.$01421790 712 02$aUnited States.$bNational Aeronautics and Space Administration, 712 02$aLewis Research Center. 801 0$bOCLCE 801 1$bOCLCE 801 2$bOCLCQ 801 2$bOCLCF 801 2$bOCLCQ 801 2$bOCLCO 801 2$bOCLCQ 801 2$bGPO 906 $aBOOK 912 $a9910715023203321 996 $aStress-strain behavior of cold-welded copper-copper microjunctions in vacuum as determined from electrical resistance measurements$93544028 997 $aUNINA