LEADER 01481aam  2200397I  450 
001 9910710755403321
005 20160421112351.0
024 8 $aGOVPUB-C13-7370179408694b808a92c2038086051a
035   $a(CKB)5470000002478753
035   $a(OCoLC)947049522
035   $a(EXLCZ)995470000002478753
100   $a20160421d2009      ua             0
101 0 $aeng
181   $2rdacontent
182   $2rdamedia
183   $2rdacarrier
200 10$aRepresentation of a thermal resistor network model of a packaged component in STEP AP210 edition 2 /$fJamie Stori; Kevin Brady; Thomas Thurman; Rockwell Collins
210  1$aGaithersburg, MD :$cU.S. Dept. of Commerce, National Institute of Standards and Technology,$d2009.
215   $a1 online resource
225 1 $aNISTIR ;$v7648
300   $a2009.
300   $aContributed record: Metadata reviewed, not verified. Some fields updated by batch processes.
300   $aTitle from PDF title page.
320   $aIncludes bibliographical references.
700   $aStori$b Jamie$01392161
701   $aBrady$b Kevin$01392162
701   $aStori$b Jamie$01392161
701   $aThurman$b Thomas$01395790
712 02$aNational Institute of Standards and Technology (U.S.)
801  0$bNBS
801  1$bNBS
801  2$bGPO
906   $aBOOK
912   $a9910710755403321
996   $aRepresentation of a thermal resistor network model of a packaged component in STEP AP210 edition 2$93538339
997   $aUNINA