LEADER 01473aam  2200397I  450 
001 9910710503803321
005 20160705110710.0
024 8 $aGOVPUB-C13-daa2161b64da3a0d59fc65175a9eda23
035   $a(CKB)5470000002478264
035   $a(OCoLC)953033030
035   $a(EXLCZ)995470000002478264
100   $a20160705d1990      ua             0
101 0 $aeng
181   $2rdacontent
182   $2rdamedia
183   $2rdacarrier
200 10$aThermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler /$fD. L. Rule; D. R. Smith; L. L. Sparks
210  1$aGaithersburg, MD :$cU.S. Dept. of Commerce, National Institute of Standards and Technology,$d1990.
215   $a1 online resource
225 1 $aNISTIR ;$v3948
300   $a1990.
300   $aContributed record: Metadata reviewed, not verified. Some fields updated by batch processes.
300   $aTitle from PDF title page.
320   $aIncludes bibliographical references.
700   $aRule$b D. L$01412068
701   $aRule$b D. L$01412068
701   $aSmith$b D. R$01412069
701   $aSparks$b Larry L$01388181
712 02$aNational Institute of Standards and Technology (U.S.)
801  0$bNBS
801  1$bNBS
801  2$bGPO
906   $aBOOK
912   $a9910710503803321
996   $aThermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler$93504678
997   $aUNINA