LEADER 02269oam 2200529 450 001 9910131303903321 005 20230807215345.0 035 $a(CKB)3710000000408758 035 $a(SSID)ssj0001616562 035 $a(PQKBManifestationID)16346572 035 $a(PQKBTitleCode)TC0001616562 035 $a(PQKBWorkID)14919645 035 $a(PQKB)11561042 035 $a(oapen)https://directory.doabooks.org/handle/20.500.12854/57879 035 $a(EXLCZ)993710000000408758 100 $a20160829d2015 uy 0 101 0 $aeng 135 $aurmn|---annan 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 00$aRecovery, renewal, reclaiming $eanthropological research toward healing /$fedited by Lindsey King 210 $cNewfound Press$d2015 210 1$aKnoxville, Tennessee :$cNewfound Press University of Tennessee Libraries,$d[2015]. 210 4$dİ2015 215 $a1 online resource (197 pages) $cillustrations 225 1 $aSouthern Anthropological Society Proceedings 311 08$aPrint version: 9780986080302 320 $aIncludes bibliographical references and index. 330 $aFaced with a world that is environmentally out of balance, that is unhealthy in many respects, and that reflects stark inequalities, anthropologists are challenging themselves and others to engage in recovery, renewal, and reclaiming. This volume grapples with these challenges head-on, providing wide-ranging discussions of concrete problems. 517 $aRecovery, Renewal, Reclaiming 606 $aDelivery of Health Care$xAccess 606 $aPublic Health 610 $aMedical anthropology--Southern States--Cross-cultural studies--Congresses 610 $aEthnology--Southern States--Congresses 610 $aPublic health--Social aspects--United States--Citizen participation--Case studies--Congresses 615 0$aDelivery of Health Care$xAccess. 615 0$aPublic Health. 700 $aLindsey King (Ed.)$4auth$01378081 702 $aKing$b Lindsey 712 02$aSouthern Anthropological Society Meeting 801 0$bPQKB 801 2$bUkMaJRU 906 $aBOOK 912 $a9910131303903321 996 $aRecovery, renewal, reclaiming$93416011 997 $aUNINA LEADER 01955oam 2200553 450 001 9910706830103321 005 20180313095143.0 035 $a(CKB)5470000002459169 035 $a(OCoLC)896810507 035 $a(OCoLC)995470000002459169 035 $a(EXLCZ)995470000002459169 100 $a20141123d1970 ea 0 101 0 $aeng 135 $aurmn||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aMesozoic stratigraphy of the Mule and Huachuca Mountains, Arizona /$fby Philip T. Hayes 210 1$aWashington :$cUnited States Department of the Interior, Geological Survey,$d1970. 215 $a1 online resource (iii, A28 pages) $cillustrations, maps 225 1 $aGeological Survey professional paper ;$v658-A 225 1 $aMesozoic stratigraphy in southeastern Arizona 300 $aTitle from title screen (viewed October 6, 2014). 300 $a"Descriptive stratigraphy of Triassic, Jurassic, and Cretaceous volcanic and sedimentary rocks." 320 $aIncludes bibliographical references (page A27-A28). 606 $aGeology$zArizona$zHuachuca Mountains 606 $aGeology$zArizona$zMule Mountains 606 $aGeology, Stratigraphic$yMesozoic 606 $aGeology$2fast 606 $aGeology, Stratigraphic$2fast 606 $aMesozoic Geologic Period$2fast 607 $aArizona$2fast 615 0$aGeology 615 0$aGeology 615 0$aGeology, Stratigraphic 615 7$aGeology. 615 7$aGeology, Stratigraphic. 615 7$aMesozoic Geologic Period. 700 $aHayes$b Philip T$g(Philip Thayer),$f1923-$01386967 712 02$aGeological Survey (U.S.), 801 0$bCOP 801 1$bCOP 801 2$bOCLCO 801 2$bOCLCF 801 2$bGPO 906 $aBOOK 912 $a9910706830103321 996 $aMesozoic stratigraphy of the Mule and Huachuca Mountains, Arizona$93510694 997 $aUNINA LEADER 03350nam 2200625Ia 450 001 9910825844003321 005 20240410110606.0 010 $a1-280-54757-X 010 $a9786610547579 010 $a1-84663-011-8 035 $a(CKB)1000000000242843 035 $a(EBL)267393 035 $a(OCoLC)71174790 035 $a(SSID)ssj0000671747 035 $a(PQKBManifestationID)11384635 035 $a(PQKBTitleCode)TC0000671747 035 $a(PQKBWorkID)10625146 035 $a(PQKB)11705436 035 $a(MiAaPQ)EBC267393 035 $a(Au-PeEL)EBL267393 035 $a(CaPaEBR)ebr10132649 035 $a(CaONFJC)MIL54757 035 $a(OCoLC)133162498 035 $a(EXLCZ)991000000000242843 100 $a20000815d2006 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aAdvanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging$b[electronic resource] /$fguest editors Christopher Bailey and Johan Liu 205 $a1st ed. 210 $aBradford, England $cEmerald Group Publishing$dc2006 215 $a1 online resource (72 p.) 225 0 $aSoldering & surface mount technology ;$vv.18, no. 2 300 $aDescription based upon print version of record. 311 $a1-84663-010-X 327 $aCover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder 327 $aFinite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary 330 $aThis issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i 410 0$aSoldering & surface mount technology ;$vv.18, no. 2. 606 $aManufacturing processes 606 $aElectronic packaging 615 0$aManufacturing processes. 615 0$aElectronic packaging. 676 $a621.381/046 701 $aBailey$b Christopher$01617464 701 $aLiu$b Johan$01617465 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910825844003321 996 $aAdvanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging$93948657 997 $aUNINA