LEADER 02108oam  2200577I  450 
001 9910706599003321
005 20171108110146.0
035   $a(CKB)5470000002456453
035   $a(OCoLC)858242416
035   $a(EXLCZ)995470000002456453
100   $a20130912j200101    ua             0
101 0 $aeng
135   $aurbn||||a|a||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aDevelopment of electronics for low-temperature space missions /$fRichard L. Patterson [and four others]
210  1$aCleveland, Ohio :$cNational Aeronautics and Space Administration, Glenn Research Center,$dJanuary 2001.
215   $a1 online resource (6 pages) $cillustrations
225 1 $aNASA/TM ;$v2001-210235
300   $a"January 2001."
300   $a"Prepared for the Fourth European Workshop on Low Temperature Electronics sponsored by the European Space Agency, Noordwijk, The Netherlands, June 21-23, 2000."
300   $a"Performing organization: National Aeronautics and Space Administration, John H. Glenn Research Center at Lewis Field"--Report documentation page.
320   $aIncludes bibliographical references (page 4).
606   $aSpace missions$2nasat
606   $aLow temperature$2nasat
606   $aElectronic equipment$2nasat
606   $aNASA space programs$2nasat
606   $aAerospace environments$2nasat
606   $aSemiconductor devices$2nasat
606   $aFabrication$2nasat
615  7$aSpace missions.
615  7$aLow temperature.
615  7$aElectronic equipment.
615  7$aNASA space programs.
615  7$aAerospace environments.
615  7$aSemiconductor devices.
615  7$aFabrication.
700   $aPatterson$b Richard L.$01392284
712 02$aNASA Glenn Research Center,
801  0$bOCLCE
801  1$bOCLCE
801  2$bOCLCO
801  2$bOCLCF
801  2$bOCLCO
801  2$bOCLCQ
801  2$bGPO
906   $aBOOK
912   $a9910706599003321
996   $aDevelopment of electronics for low-temperature space missions$93446763
997   $aUNINA