LEADER 01300oam  2200433I  450 
001 9910705889503321
005 20190905144548.0
035   $a(CKB)5470000002453518
035   $a(OCoLC)318683284
035   $a(EXLCZ)995470000002453518
100   $a20090122d2008      ka             0
101 0 $aeng
135   $aurcn|||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aThermal simulation of four die-attach materials /$fGregory K. Ovrebo
210  1$aAdelphi, MD :$cArmy Research Laboratory,$d2008.
215   $a1 online resource (iv, 10 pages) $ccolor illustrations
300   $a"ARL-MR-0686."
300   $a"January 2008."
606   $aHeat$xTransmission$zUnited States
606   $aPrinted circuits
606   $aSilicon carbide$zUnited States
606   $aElectric circuits
615  0$aHeat$xTransmission
615  0$aPrinted circuits.
615  0$aSilicon carbide
615  0$aElectric circuits.
700   $aOvrebo$b Gregory K.$01394411
712 02$aU.S. Army Research Laboratory,
801  0$bDTICE
801  1$bDTICE
801  2$bOCLCQ
801  2$bGPO
906   $aBOOK
912   $a9910705889503321
996   $aThermal simulation of four die-attach materials$93460355
997   $aUNINA