LEADER 01405oam  2200421I  450 
001 9910702603903321
005 20150806133206.0
035   $a(CKB)5470000002430155
035   $a(OCoLC)227941243
035   $a(EXLCZ)995470000002430155
100   $a20080513d2007      ua             0
101 0 $aeng
135   $aurcn|||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aFlip chip hybridization using indium bump technology at ARL /$fKimberley A. Olver
210  1$aAdelphi. MD :$cArmy Research Laboratory,$d[2007]
215   $a1 online resource (iv, 8 pages) $ccolor illustrations
300   $aTitle from title screen (viewed on Aug. 4, 2015).
300   $a"July 2007."
300   $a"ARL-TN-283."
320   $aIncludes bibliographical references (page 5).
517 3 $aFlip chip hybridization using indium bump technology at Army Research Laboratory
606   $aMicroelectronics
606   $aIntegrated circuits$xWelding
615  0$aMicroelectronics.
615  0$aIntegrated circuits$xWelding.
700   $aOlver$b Kimberley A.$01397178
712 02$aU.S. Army Research Laboratory,
801  0$bDTICE
801  1$bDTICE
801  2$bOCLCQ
801  2$bGPO
906   $aBOOK
912   $a9910702603903321
996   $aFlip chip hybridization using indium bump technology at ARL$93458528
997   $aUNINA