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005 20110928105917.0
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035   $a(OCoLC)713319161
035   $a(EXLCZ)995470000002414276
100   $a20110214d2010      ua             0
101 0 $aeng
135   $aurmn|||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 12$aA new technique for wirebonding using indium spheres$b[electronic resource] /$fKimberley A. Olver
210  1$aAdelphi, MD :$cArmy Research Laboratory,$d[2010]
215   $a1 online resource (vi, 6) $ccolor illustrations
225 1 $aARL-TR ;$v5240
300   $aTitle from title screen (viewed on Sept. 28, 2011).
300   $a"July 2010."
320   $aIncludes bibliographical references (page 5).
606   $aMercury cadmium tellurides
606   $aWire bonding (Electronic packaging)
615  0$aMercury cadmium tellurides.
615  0$aWire bonding (Electronic packaging)
700   $aOlver$b Kimberley A$01397178
712 02$aU.S. Army Research Laboratory.
801  0$bDTICE
801  1$bDTICE
801  2$bGPO
906   $aBOOK
912   $a9910701075903321
996   $aA new technique for wirebonding using indium spheres$93486338
997   $aUNINA