LEADER 01799nam  2200529Ia 450 
001 9910701055503321
005 20111103160702.0
035   $a(CKB)5470000002414482
035   $a(OCoLC)759522069
035   $a(EXLCZ)995470000002414482
100   $a20111103d2011      ua             0
101 0 $aeng
135   $aurcn|||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 00$aMicrocoil spring interconnects for ceramic grid array integrated circuits$b[electronic resource] /$fS.M. Strickland ... [and others]
210  1$aMSFC, Ala. :$cNational Aeronautics and Space Administration, Marshall Space Flight Center,$d[2011]
215   $a1 online resource (vi, 21 pages) $ccolor illustrations
225 1 $aNASA/TM ;$v2011-216463
300   $aTitle from title screen (viewed on Nov. 3, 2011).
300   $a"March 2011."
320   $aIncludes bibliographical references (page 21).
606   $aShock tests$2nasat
606   $aCeramics$2nasat
606   $aIntegrated circuits$2nasat
606   $aSolders$2nasat
606   $aPrinted circuits$2nasat
606   $aSignal analyzers$2nasat
606   $aThermal cycling tests$2nasat
606   $aDigital systems$2nasat
615  7$aShock tests.
615  7$aCeramics.
615  7$aIntegrated circuits.
615  7$aSolders.
615  7$aPrinted circuits.
615  7$aSignal analyzers.
615  7$aThermal cycling tests.
615  7$aDigital systems.
701   $aStrickland$b S. M$01419550
712 02$aGeorge C. Marshall Space Flight Center.
801  0$bGPO
801  1$bGPO
906   $aBOOK
912   $a9910701055503321
996   $aMicrocoil spring interconnects for ceramic grid array integrated circuits$93534406
997   $aUNINA