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200 10$aResidential appraisals$b[electronic resource] $eopportunities to enhance oversight of an evolving industry : testimony before the Subcommittee on Insurance, Housing and Community Opportunity, Committee on Financial Services, House of Representatives /$fstatement of William B. Shear
210  1$a[Washington, D.C.] :$cU.S. Govt. Accountability Office,$d[2011]
215   $a1 online resource (9 pages)
225 1 $aTestimony ;$vGAO-11-783T
300   $aTitle from PDF title screen (viewed Sept. 1, 2011).
300   $a"For release ... July 13, 2011."
320   $aIncludes bibliographical references.
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200 10$aIEEE Std 1101.1-1991 $eIEEE Standard for Mechanical Core Specifications for Microcomputers Using IEC 603-2 Connectors /$fInstitute of Electrical and Electronics Engineers
210  1$aNew York :$cIEEE,$d1992.
215   $a1 online resource (52 pages) $cillustrations
330   $aSuperseded by 1101.1-1998 (SH/SS94691) The basic dimensions of a range of modular subracks conforming to IEC 60297-3 (1984-01) and IEC 60297-4 (1995-03) for mounting in equipment according to IEC 60297-1 (1986-09) andANSI/EIA 310-D-1992, together with the basic dimensions of a compatible range of plug-in units,printed boards, and backplanes, are covered. The dimensions and tolerances necessary to ensuremechanical function compatibility are provided. This standard offers total system integration guide-lines with attendant advantages, such as reduction in design and development time, manufacturingcost savings, and distinct marketing advantages.
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606   $aExpansion boards (Microcomputers)
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