LEADER 01615nam  2200433 a 450 
001 9910699291803321
005 20230902161936.0
035   $a(CKB)5470000002400984
035   $a(OCoLC)711905679
035   $a(EXLCZ)995470000002400984
100   $a20110408d2002      ua             0
101 0 $aeng
135   $aurmn|||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aTest procedures for developing solder data$b[electronic resource] /$fNEMI Task Group on Lead-Free Alloys and Reliability ; edited by T.A. Siewert and C.A. Handwerker
210  1$a[Gaithersburg, Md.] :$cU.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology,$d[2002]
215   $a1 online resource (viii, 33 pages) $c1 illustration
225 1 $aNIST recommended practice guide
225 1 $aNIST special publication ;$vno. 960-8
300   $aTitle from title screen (viewed on April 7, 2011).
300   $a"August 2002."
320   $aIncludes bibliographical references (page 33).
410  0$aNIST recommended practice guide.
410  0$aNIST special publication ;$vno. 960-8.
606   $aSolder and soldering
606   $aAlloys
615  0$aSolder and soldering.
615  0$aAlloys.
701   $aSiewert$b T. A$01399439
701   $aHandwerker$b Carol A$01342255
712 02$aNational Institute of Standards and Technology (U.S.)
801  0$bGPO
801  1$bGPO
906   $aBOOK
912   $a9910699291803321
996   $aTest procedures for developing solder data$93464634
997   $aUNINA