LEADER 01777nam  2200469Ia 450 
001 9910699291703321
005 20230902161933.0
035   $a(CKB)5470000002400985
035   $a(OCoLC)713565269
035   $a(EXLCZ)995470000002400985
100   $a20110420d2001      ua             0
101 0 $aeng
135   $aurbn|||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aCapacitance cell measurement of the out-of-plane expansion of thin films$b[electronic resource] /$fChad R. Snyder, Frederick I. Mopsik
210  1$a[Gaithersburg, Md.] :$cU.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology,$d[2001]
215   $a1 online resource (x, 32 pages) $cillustrations
225 1 $aNIST special publication ;$vno. 960-7
225 1 $aNIST recommended practice guide
300   $aTitle from title screen (viewed Apr. 19, 2011).
300   $a"November 2001."
300   $a"CODEN: NSPUE2."
320   $aIncludes bibliographical references (pages 31-32).
410  0$aNIST recommended practice guide.
410  0$aNIST special publication ;$vno. 960-7.
606   $aThin-film circuits
606   $aThin films$xThermal properties
606   $aExpansion (Heat)$xMeasurement
615  0$aThin-film circuits.
615  0$aThin films$xThermal properties.
615  0$aExpansion (Heat)$xMeasurement.
700   $aSnyder$b Chad R$01399993
701   $aMopsik$b F. I$01402055
712 02$aNational Institute of Standards and Technology (U.S.)
801  0$bGPO
801  1$bGPO
906   $aBOOK
912   $a9910699291703321
996   $aCapacitance cell measurement of the out-of-plane expansion of thin films$93494589
997   $aUNINA