LEADER 05372nam 22006853u 450 001 9910146242703321 005 20220408225037.0 010 $a1-280-55760-5 010 $a9786610557608 010 $a3-527-60016-7 035 $a(CKB)1000000000019319 035 $a(EBL)822727 035 $a(OCoLC)768732534 035 $a(SSID)ssj0000310784 035 $a(PQKBManifestationID)11264590 035 $a(PQKBTitleCode)TC0000310784 035 $a(PQKBWorkID)10312957 035 $a(PQKB)10986897 035 $a(MiAaPQ)EBC5247739 035 $a(Au-PeEL)EBL5247739 035 $a(CaONFJC)MIL55760 035 $a(OCoLC)1027167757 035 $a(EXLCZ)991000000000019319 100 $a20131028d2011|||| u|| | 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aSurface and Thin Film Analysis $eA Compendium of Principles, Instrumentation and Applications 205 $a2nd ed. 210 $aHoboken $cWiley$d2011 215 $a1 online resource (559 p.) 300 $aDescription based upon print version of record. 311 $a3-527-30458-4 327 $aSurface and Thin Film Analysis: A Compendium of Principles, Instrumentation, and Applications; Contents; Preface to the First Edition; Preface to the Second Edition; List of Contributors; 1: Introduction; Part One: Electron Detection; 2: X-Ray Photoelectron Spectroscopy (XPS); 2.1 Principles; 2.2 Instrumentation; 2.2.1 Vacuum Requirements; 2.2.2 X-Ray Sources; 2.2.3 Synchrotron Radiation; 2.2.4 Electron Energy Analyzers; 2.2.5 Spatial Resolution; 2.3 Spectral Information and Chemical Shifts; 2.4 Quantification, Depth Profiling, and Imaging; 2.4.1 Quantification; 2.4.2 Depth Profiling 327 $a2.4.3 Imaging2.5 The A uger Parameter; 2.6 Applications; 2.6.1 Catalysis; 2.6.2 Polymers; 2.6.3 Corrosion and Passivation; 2.6.4 Adhesion; 2.6.5 Superconductors; 2.6.6 Semiconductors; 2.7 Ultraviolet Photoelectron Spectroscopy (UPS); References; 3: Auger Electron Spectroscopy (AES); 3.1 Principles; 3.2 Instrumentation; 3.2.1 Vacuum Requirements; 3.2.2 Electron Sources; 3.2.3 Electron-Energy Analyzers; 3.3 Spectral Information; 3.4 Quantification and Depth Profiling; 3.4.1 Quantification; 3.4.2 Depth Profiling; 3.5 Applications; 3.5.1 Grain Boundary Segregation; 3.5.2 Semiconductor Technology 327 $a3.5.3 Thin Films and Interfaces3.5.4 Surface Segregation; 3.6 Scanning A uger Microscopy (SAM); References; 4: Electron Energy-Loss Spectroscopy (EELS) and Energy-Filtering Transmission Electron Microscopy (EFTEM); 4.1 Principles; 4.2 Instrumentation; 4.3 Qualitative Spectral Information; 4.3.1 Low-Loss Excitations; 4.3.2 Ionization Losses; 4.3.3 Fine Structures; 4.4 Quantification; 4.5 Imaging of Element Distribution; 4.6 Summary; References; 5: Low-Energy Electron Diffraction (LEED); 5.1 Principles and History; 5.2 Instrumentation; 5.3 Qualitative Information; 5.3.1 LEED Pattern 327 $a5.3.2 Spot Profile Analysis5.3.3 Applications and Restrictions; 5.4 Quantitative Structural Information; 5.4.1 Principles; 5.4.2 Experimental Techniques; 5.4.3 Computer Programs; 5.4.4 Applications and Restrictions; 5.5 Low-Energy Electron Microscopy; 5.5.1 Principles of Operation; 5.5.2 Applications and Restrictions; References; 6: Other Electron-Detecting Techniques; 6.1 Ion (Excited) Auger Electron Spectroscopy (IAES); 6.2 Ion Neutralization Spectroscopy (INS); 6.3 Inelastic Electron Tunneling Spectroscopy (IETS); Reference; Part Two: Ion Detection 327 $a7: Static Secondary Ion Mass Spectrometry (SSIMS)7.1 Principles; 7.2 Instrumentation; 7.2.1 Ion Sources; 7.2.2 Mass Analyzers; 7.2.2.1 Quadrupole Mass Spectrometers; 7.2.2.2 Time-of-Flight Mass Spectrometry (TOF-MS); 7.3 Quantification; 7.4 Spectral Information; 7.5 Applications; 7.5.1 Oxide Films; 7.5.2 Interfaces; 7.5.3 Polymers; 7.5.4 Biosensors; 7.5.5 Surface Reactions; 7.5.6 Imaging; 7.5.7 Ultra-Shallow Depth Profiling; References; 8: Dynamic Secondary Ion Mass Spectrometry (SIMS); 8.1 Principles; 8.1.1 Compensation of Preferential Sputtering; 8.1.2 Atomic Mixing 327 $a8.1.3 Implantation of Primary Ions 330 $aSurveying and comparing all techniques relevant for practical applications, this second edition of a bestseller is a vital guide to this hot topic in nano- and surface technology. Completely revised and updated, sections include electron, ion and photon detection, as well as scanning microscopy, while new chapters have been added to cover such recently developed techniques as SNOM, SERS, and laser ablation. Over 500 references and a list of equipment suppliers make this a rapid reference for materials scientists, analytical chemists, and those working in the biotechnological industry. 606 $aThin films$xAnalysis$xSurfaces 606 $aElectron spectroscopy 606 $aSpectrum analysis 608 $aElectronic books. 615 0$aThin films$xAnalysis$xSurfaces 615 0$aElectron spectroscopy 615 0$aSpectrum analysis 676 $a530.4275 676 $a541.33 700 $aBubert$b Henning$0903323 701 $aJenett$b Holger$0921755 801 0$bAU-PeEL 801 1$bAU-PeEL 801 2$bAU-PeEL 906 $aBOOK 912 $a9910146242703321 996 $aSurface and Thin Film Analysis$92068027 997 $aUNINA LEADER 01350oam 2200421Ka 450 001 9910693092303321 005 20050107134203.0 035 $a(CKB)5470000002358578 035 $a(OCoLC)53282730 035 9 $aocm53282730 035 $a(OCoLC)995470000002358578 035 $a(EXLCZ)995470000002358578 100 $a20031024d1999 ua 0 101 0 $aeng 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 00$aAsian medicinals questions and answers$b[electronic resource] /$fU.S. Fish and Wildlife Service 210 1$aArlington, Va. :$cU.S. Fish and Wildlife Service, Office of Management Authority,$d[1999] 300 $aTitle from title screen (viewed on Jan. 7, 2005). 300 $a"November 1999." 606 $aMedicine, Chinese 606 $aArsenic$xToxicology$zAsia 606 $aMercury$xToxicology$zAsia 606 $aEndangered species$zAsia 615 0$aMedicine, Chinese. 615 0$aArsenic$xToxicology 615 0$aMercury$xToxicology 615 0$aEndangered species 712 02$aU.S. Fish and Wildlife Service.$bOffice of Management Authority. 801 0$bUXW 801 1$bUXW 801 2$bOCLCQ 801 2$bGPO 906 $aBOOK 912 $a9910693092303321 996 $aAsian medicinals questions and answers$93211487 997 $aUNINA