LEADER 02046nam  2200349   450 
001 9910688380503321
005 20230630102714.0
024 7 $a10.5772/intechopen.76955
035   $a(CKB)5400000000045963
035   $a(NjHacI)995400000000045963
035   $a(EXLCZ)995400000000045963
100   $a20230630d2019      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 00$aLead Free Solders /$fedited by Abhijit Kar
210  1$aLondon :$cIntechOpen,$d2019.
215   $a1 online resource (94 pages) $cillustrations
311   $a1-83962-278-4 
330   $aThis book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.
606   $aSolder and soldering
615  0$aSolder and soldering.
676   $a671.56
702   $aKar$b Abhijit
801  0$bNjHacI
801  1$bNjHacl
906   $aBOOK
912   $a9910688380503321
996   $aLead Free Solders$92081909
997   $aUNINA