LEADER 04659nam 22006375 450 001 9910631092503321 005 20251009105826.0 010 $a9783031172076$b(electronic bk.) 010 $z9783031172069 024 7 $a10.1007/978-3-031-17207-6 035 $a(MiAaPQ)EBC7141553 035 $a(Au-PeEL)EBL7141553 035 $a(CKB)25360910800041 035 $a(OCoLC)1351202970 035 $a(PPN)266349196 035 $a(DE-He213)978-3-031-17207-6 035 $a(EXLCZ)9925360910800041 100 $a20221116d2022 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aAdvanced Materials and Components for 5G and Beyond /$fby Colin Tong 205 $a1st ed. 2022. 210 1$aCham :$cSpringer Nature Switzerland :$cImprint: Springer,$d2022. 215 $a1 online resource (276 pages) 225 1 $aSpringer Series in Materials Science,$x2196-2812 ;$v327 311 08$aPrint version: Tong, Colin Advanced Materials and Components for 5G and Beyond Cham : Springer,c2022 9783031172069 320 $aIncludes bibliographical references and index. 327 $aChapter 1. 5G technology components and material solutions for hardware system integration -- Chapter 2. Semiconductor solutions for 5G -- Chapter 3. Design and performance enhancement for 5G antennas and beamforming integrated circuits -- Chapter 4. PCB materials and design requirements for 5G systems -- Chapter 5. Materials for high frequency filters -- Chapter 6. EMI shielding materials and absorbers for 5G communications -- Chapter 7. Thermal management materials and components for 5G devices -- Chapter 8. Protective packaging and sealing materials for 5G mobile devices -- Chapter 9. Perspectives on 5G and beyond applications and related technologies. 330 $aThis book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for today?s students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account. 410 0$aSpringer Series in Materials Science,$x2196-2812 ;$v327 606 $aOptical communications 606 $aSemiconductors 606 $aTelecommunication 606 $aOptical Communications 606 $aSemiconductors 606 $aCommunications Engineering, Networks 606 $aMicrowaves, RF Engineering and Optical Communications 615 0$aOptical communications. 615 0$aSemiconductors. 615 0$aTelecommunication. 615 14$aOptical Communications. 615 24$aSemiconductors. 615 24$aCommunications Engineering, Networks. 615 24$aMicrowaves, RF Engineering and Optical Communications. 676 $a405 676 $a621.38456 700 $aTong$b Xingcun Colin$01063324 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 912 $a9910631092503321 996 $aAdvanced materials and components for 5G and beyond$93083054 997 $aUNINA