LEADER 02484oas  22007573a 450 
001 9910625171303321
005 20251106213014.0
035   $a(OCoLC)430058414
035   $a(CONSER)  2009204101
035   $a(CKB)1000000000771037
035   $a(EXLCZ)991000000000771037
100   $a20090811a20079999  sy         a
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aProceedings of technical papers
210   $aPiscataway, NJ $cInstitute of Electrical and Electronics Engineers
300   $aPublished by Institute of Electrical and Electronics Engineers in association with individual conference organizations.
311 08$a2150-5942 
517 1 $aMicrosystems, Packaging, Assembly and Circuits Technology (IMPACT), International
517 1 $aInternational Microsystems, Packaging, Assembly, and Circuits Technology Conference
517 1 $aIMPACT
531 0 $aProc. tech. pap.
606   $aMicroelectronic packaging$vCongresses
606   $aElectronic packaging$vCongresses
606   $aMicroelectronics$vCongresses
606   $aMise sous boi?tier (Microe?lectronique)$vCongre?s
606   $aMise sous boi?tier (E?lectronique)$vCongre?s
606   $aMicroe?lectronique$vCongre?s
606   $aElectronic packaging$2fast$3(OCoLC)fst00907414
606   $aMicroelectronic packaging$2fast$3(OCoLC)fst01019751
606   $aMicroelectronics$2fast$3(OCoLC)fst01019757
608   $aConference papers and proceedings.$2fast
615  0$aMicroelectronic packaging
615  0$aElectronic packaging
615  0$aMicroelectronics
615  6$aMise sous boi?tier (Microe?lectronique)
615  6$aMise sous boi?tier (E?lectronique)
615  6$aMicroe?lectronique
615  7$aElectronic packaging.
615  7$aMicroelectronic packaging.
615  7$aMicroelectronics.
676   $a621.381
712 02$aInstitute of Electrical and Electronics Engineers
801  0$bDLC
801  1$bDLC
801  2$bSTF
801  2$bOCLCQ
801  2$bOCLCF
801  2$bOCLCO
801  2$bOCL
801  2$bOCLCO
801  2$bOCLCQ
801  2$bOCLCA
801  2$bU3W
801  2$bOCLCL
801  2$bTXA
801  2$bAU@
801  2$bOCLCL
801  2$bOCLCQ
906   $aJOURNAL
912   $a9910625171303321
996   $aProceedings of technical papers$91888335
997   $aUNINA