LEADER 02930nam 2200445 450 001 9910583481003321 005 20230120002728.0 010 $a0-12-410501-7 035 $a(CKB)4100000000880598 035 \\$a(Safari)9780124104846 035 $a(OCoLC)994223047 035 $a(CaSebORM)9780124104846 035 $a(MiAaPQ)EBC4901158 035 $a(EXLCZ)994100000000880598 100 $a20170728h20172009 uy 0 101 0 $aeng 135 $aurunu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aThree-dimensional integrated circuit design /$fVisileios Pavlidis, Eby Freidman 205 $aSecond edition. 210 1$aCambridge, Massachusetts :$cMorgan Kaufmann Publishers,$d2017. 215 $a1 online resource (1 volume) $cillustrations 311 $a0-12-410484-3 320 $aIncludes bibliographical references at the end of each chapters and index. 330 $aThree-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization 606 $aThree-dimensional integrated circuits$xDesign and construction 615 0$aThree-dimensional integrated circuits$xDesign and construction. 676 $a621.395 700 $aPavlidis$b Visileios$0984246 702 $aSavidis$b Ioannis 702 $aFriedman$b Eby G. 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910583481003321 996 $aThree-dimensional integrated circuit design$92247945 997 $aUNINA