LEADER 02617nam 2200421 450 001 9910583390903321 005 20230120002726.0 010 $a0-08-102095-3 010 $a0-08-102094-5 035 $a(CKB)4100000004096035 035 $a(MiAaPQ)EBC5404290 035 $a(EXLCZ)994100000004096035 100 $a20180621d2018 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 00$aWide bandgap power semiconductor packaging $ematerials, components, and reliability /$fedited by Katsuaki Suganuma 210 1$aDuxford, United Kingdom :$cWoodhead Publishing is an imprint of Elsevier,$d[2018] 210 4$dİ2018 215 $a1 online resource (242 pages) 225 1 $aWoodhead Publishing Series in Electronic and Optical Materials 330 $a"Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates"--$cProvided by publisher. 410 0$aWoodhead Publishing series in electronic and optical materials. 606 $aWide gap semiconductors 606 $aMicroelectronic packaging 615 0$aWide gap semiconductors. 615 0$aMicroelectronic packaging. 676 $a621.38152 702 $aSuganuma$b Katsuaki 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910583390903321 996 $aWide bandgap power semiconductor packaging$92019413 997 $aUNINA