LEADER 03709nam 2200793z- 450 001 9910557629703321 005 20231214133246.0 035 $a(CKB)5400000000045117 035 $a(oapen)https://directory.doabooks.org/handle/20.500.12854/76862 035 $a(EXLCZ)995400000000045117 100 $a20202201d2021 |y 0 101 0 $aeng 135 $aurmn|---annan 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aSurface and Interface Engineering for Organic Device Applications 210 $aBasel, Switzerland$cMDPI - Multidisciplinary Digital Publishing Institute$d2021 215 $a1 electronic resource (114 p.) 311 $a3-0365-1990-4 311 $a3-0365-1991-2 330 $aIn the last few decades, organic materials (or carbon-based materials in a broad sense), including polymers, have received much attention for their potential applications in electronics, because they have outstanding advantages such as high processibility, mechanical flexibility, and low weight. Extensive research efforts have thus been devoted to the development and advancement of organic materials for various applications, covering a wide range from molecular design to device fabrication methods. In addition, it has been recognized that surfaces and interfaces play a crucial role in the operation and performance of the devices. For instance, various interactions at organic?metal interfaces are of great importance in organic epitaxy, and also have a strong correlation with intermolecular structures and their electronic properties. In this context, the main focus of this Special Issue was collecting scientific contributions addressing surface and interface engineering with organic materials, and related applications. The diversity of contributions presented in this Special Issue exhibits relevant progress and the potential of organic materials in a variety of applications that are not limited to the fabrication of organic devices. 606 $aTechnology: general issues$2bicssc 610 $asilk fibroin 610 $ahybrid nanoflowers surface 610 $aPb(II) removal 610 $ainteraction mechanism 610 $aoff-axis conic surface 610 $ashape accuracy 610 $aauto-collimation 610 $asingle CGH 610 $ahybrid compensation 610 $aorganic electronics 610 $aliquid semiconductors 610 $acharge injection 610 $asurface engineering 610 $acrack engineering 610 $aeutectic gallium indium 610 $aEGaIn 610 $aliquid metal 610 $agallium alloy 610 $aflexible photodetector 610 $aflexible electronics 610 $aperovskite solar cells 610 $aperformance improvement 610 $alead acetate 610 $acesium doping 610 $astimuli-responsive hydrogels 610 $athermogelling polymers 610 $asol-gel transition behaviors 610 $acomplex colloidal systems 610 $aconducting polymer 610 $aPEDOT:PSS 610 $aelectrical conductivity 610 $aprocessing additive 610 $alinear glycol 610 $asigmoidal function 610 $aliquid metals 610 $agallium alloys 610 $aGalinstan 610 $aflexible electronics photodetectors 610 $asolar-blind photodetection 615 7$aTechnology: general issues 700 $aKim$b Ju-Hyung$4edt$01314053 702 $aKim$b Ju-Hyung$4oth 906 $aBOOK 912 $a9910557629703321 996 $aSurface and Interface Engineering for Organic Device Applications$93031630 997 $aUNINA